Datasheet

dsPIC33FJXXXMCX06A/X08A/X10A
DS70594D-page 280  2009-2012 Microchip Technology Inc.
26.1 DC Characteristics
TABLE 26-1: OPERATING MIPS vs. VOLTAGE
Param
No.
VDD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC33FJXXXMCX06A/X08A/X10A
—
V
BOR-3.6V
(1)
-40°C to +85°C 40
—
V
BOR-3.6V
(1)
-40°C to +125°C 40
Note 1: Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Ta bl e 2 6 - 11
for the minimum and maximum BOR values.
TABLE 26-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
dsPIC33FJXXXMCX06A/X08A/X10A
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range T
A -40 — +85 °C
Extended Temperature Devices
Operating Junction Temperature Range T
J -40 — +155 °C
Operating Ambient Temperature Range TA -40 — +125 °C
Power Dissipation:
Internal Chip Power Dissipation:
P
INT = VDD x (IDD –  IOH)
PD PINT + PI/O W
I/O Pin Power Dissipation:
I/O =  ({V
DD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/JA W
TABLE 26-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm) 
JA 40 — °C/W 1
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm) JA 40 — °C/W 1
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm) 
JA 40 — °C/W 1
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm) JA 40 — °C/W 1
Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm) JA 28 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (JA) numbers are achieved by package simulations.