Datasheet

 2001-2012 Microchip Technology Inc. Confidential DS21661E-page 11
TCM809/TCM810
APPENDIX A: REVISION HISTORY
Revision E (December 2012)
• Added a note to each package outline drawing.
Revision D (March 2005)
• Updated 6.0 “Packaging Information” to include
old and new packaging examples.
• Applied new template and rearranged sections to
be consistent with current documentation.
Revision C (April 2004)
Revision B (January 2002)
Revision A (May 2001)
Initial release of data sheet.