Datasheet

© 2007 Microchip Technology Inc. DS21483D-page 19
TC9400/9401/9402
14-Lead Ceramic Dual In-Line (JD) – .300" Body [CERDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 14
Pitch e .100 BSC
Top to Seating Plane A – – .200
Standoff § A1 .015 – –
Ceramic Package Height A2 .140 – .175
Shoulder to Shoulder Width E .290 – .325
Ceramic Package Width E1 .230 .288 .300
Overall Length D .740 .760 .780
Tip to Seating Plane L .125 – .200
Lead Thickness c .008 – .015
Upper Lead Width b1 .045 – .065
Lower Lead Width b .015 – .023
Overall Row Spacing E2 .320 – .410
N
E1
D
1
2
NOTE 1
A
A1
b1
b
e
L
A2
E
c
E2
Microchip Technology Drawing C04-002
B