Datasheet

 2002-2012 Microchip Technology Inc. DS21459E-page 21
TC7129
44-Lead Plastic Quad Flatpack (KW) 10x10x2.0 mm Body, 1.95/0.25 mm Lead Form (PQFP)
CHAMFER VARIES
D
E1
E
p
c
B
D1
n
L
2
1
F
A1
A
A2



1.95 REF..077 REF.FFootprint
Units INCHES MILLIMETERS
*
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins
n
44 44
Pitch
p
.031 BSC 0.80 BSC
Overall Height A - - .096 - - 2.45
Molded Package Thickness A2 .077 .079 .083 1.95 2.00 2.10
Standoff
§ A1 .010 - - 0.25 - -
Foot Length L .029 .035 .041 0.73 0.88 1.03
Foot Angle

0° 3.5° 7° 0° 3.5° 7°
Overall Width E .547 BSC 13.90 BSC
Overall Length D .547 BSC 13.90 BSC
Molded Package Width E1 .394 BSC 10.00 BSC
Molded Package Length D1 .394 BSC 10.00 BSC
Lead Thickness
c
.004 - .009 0.11 - 0.23
Lead Width B .012 - .018 0.30 - 0.45
Mold Draft Angle Top

5° - 16° 5° - 16°
Mold Draft Angle Bottom

5° - 16° 5° - 16°
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Notes:
JEDEC Equivalent: MO-112 AA-1
Revised 07-21-05
* Controlling Parameter
§ Significant Characteristic
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
See ASME Y14.5M
Drawing No. C04-119
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging