Datasheet

TC7129
DS21459E-page 20  2002-2012 Microchip Technology Inc.
44-Lead Plastic Leaded Chip Carrier (LW) – Square (PLCC)
CH2 x 45 CH1 x 45
10501050

Mold Draft Angle Bottom
10501050

Mold Draft Angle Top
0.530.510.33.021.020.013B
0.810.740.66.032.029.026B1Upper Lead Width
0.330.270.20.013.011.008
c
Lead Thickness
1111n1Pins per Side
16.0015.7514.99.630.620.590D2Footprint Length
16.0015.7514.99.630.620.590
E2
Footprint Width
16.6616.5916.51.656.653.650D1Molded Package Length
16.6616.5916.51.656.653.650E1Molded Package Width
17.6517.5317.40.695.690.685DOverall Length
17.6517.5317.40.695.690.685EOverall Width
0.250.130.00.010.005.000
CH2Corner Chamfer (others)
1.271.141.02.050.045.040CH1Corner Chamfer 1
0.860.740.61.034.029.024A3Side 1 Chamfer Height
0.51.020A1Standoff §
A2Molded Package Thickness
4.574.394.19.180.173.165AOverall Height
1.27.050
p
Pitch
4444
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units

A2
c
E2
2
D
D1
n
#leads=n1
E
E1
1

p
A3
A
35
B1
B
D2
A1
.145 .153 .160 3.68 3.87 4.06
.028 .035 0.71 0.89
Lower Lead Width
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging