Datasheet
Table Of Contents
- 1.0 Electrical characteristics
- 2.0 Pin Descriptions
- 3.0 Detailed Description
- 4.0 Typical Applications
- 4.1 TC7129 as a Replacement Part
- 4.2 Powering the TC7129
- 4.3 Connecting to External Logic
- 4.4 Temperature Compensation
- 4.5 RC Oscillator
- 4.6 Measuring Techniques
- 4.7 Dual-Slope Conversion
- 4.8 Successive Integration
- 4.9 Digital Auto-Zeroing
- 4.10 Inside the TC7129
- 4.11 Integrator Section
- 4.12 Continuity Indicator
- 4.13 Common and Digital Ground
- 4.14 Low Battery
- 4.15 Sequence and Results Counter
- 4.16 Overrange and Underrange Outputs
- 4.17 LATCH/Hold
- 4.18 Display Driver
- 5.0 Packaging Information
- 6.0 Revision History
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2002-2012 Microchip Technology Inc. DS21459E-page 19
TC7129
40-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)
1510515105
Mold Draft Angle Bottom
1510515105
Mold Draft Angle Top
17.2716.5115.75.680.650.620eBOverall Row Spacing §
0.560.460.36.022.018.014BLower Lead Width
1.781.270.76.070.050.030B1Upper Lead Width
0.380.290.20.015.012.008
c
Lead Thickness
3.433.303.05.135.130.120LTip to Seating Plane
52.4552.2651.942.0652.0582.045DOverall Length
14.2213.8413.46.560.545.530E1Molded Package Width
15.8815.2415.11.625.600.595EShoulder to Shoulder Width
0.38.015A1Base to Seating Plane
4.063.813.56.160.150.140
A2
Molded Package Thickness
4.834.454.06.190.175.160ATop to Seating Plane
2.54.100
p
Pitch
4040
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
A2
1
2
D
n
E1
c
eB
E
p
L
B
B1
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging