Datasheet

 2002-2012 Microchip Technology Inc. DS21419D-page 13
TC4420/TC4429
8-Lead Ceramic Dual In-line – 300 mil (JA) (CERDIP)
10.169.158.13.400.360.320
eB
Overall Row Spacing
0.510.460.41.020.018.016BLower Lead Width
1.651.401.14.065.055.045
B1
Upper Lead Width
0.380.290.20.015.012.008
c
Lead Thickness
5.084.133.18.200.163.125LTip to Seating Plane
10.169.789.40.400.385.370DOverall Length
7.626.735.84.300.265.230
E1
Ceramic Pkg. Width
8.137.757.37.320.305.290EShoulder to Shoulder Width
1.020.770.51.040.030.020
A1
Standoff §
5.084.574.06.200.180.160ATop to Seating Plane
2.54.100
p
Pitch
88
n
Number of Pins
MAX
NOM
MINMAX
NOM
MINDimension Limits
MILLIMETERSINCHES*Units
JEDEC Equivalent: MS-030
Drawing No. C04-010
*Controlling Parameter
1
2
D
n
E1
c
eB
E
p
L
A2
B
B1
A
A1
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging