Datasheet

 2006-2013 Microchip Technology Inc. DS20001422F-page 9
TC4426/TC4427/TC4428
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
(
1
)
3.1 Inputs A and B
MOSFET driver inputs A and B are high-impedance,
TTL/CMOS compatible inputs. These inputs also have
300 mV of hysteresis between the high and low
thresholds that prevents output glitching even when the
rise and fall time of the input signal is very slow.
3.2 Ground (GND)
Ground is the device return pin. The ground pin(s)
should have a low-impedance connection to the bias
supply source return. High peak current flows out the
ground pin(s) when the capacitive load is being
discharged.
3.3 Output A and B
MOSFET driver outputs A and B are low-impedance,
CMOS push-pull style outputs. The pull-down and pull-
up devices are of equal strength, making the rise and
fall times equivalent.
3.4 Supply Input (V
DD
)
The V
DD
input is the bias supply for the MOSFET driver
and is rated for 4.5V to 18V with respect to the ground
pin. The V
DD
input should be bypassed with local
ceramic capacitors. The value of these capacitors
should be chosen based on the capacitive load that is
being driven. A value of 1.0 µF is suggested.
3.5 Exposed Metal Pad
The exposed metal pad of the 6x5 DFN-S package is
not internally connected to any potential. Therefore,
this pad can be connected to a ground plane or other
copper plane on a Printed Circuit Board (PCB), to aid
in heat removal from the package.
8-Pin PDIP/
MSOP/SOIC
8-Pin
DFN-S
Symbol Description
1 1 NC No connection
2 2 IN A Input A
33GNDGround
4 4 IN B Input B
55OUT BOutput B
66V
DD
Supply input
77OUT AOutput A
8 8 NC No connection
— PAD NC Exposed Metal Pad
Note 1: Duplicate pins must be connected for proper operation.