Datasheet

2002-2013 Microchip Technology Inc. DS20001423H-page 3
TC4426A/TC4427A/TC4428A
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage .....................................................+22V
Input Voltage, IN A or IN B
.....................................(V
DD
+ 0.3V) to (GND – 5V)
Package Power Dissipation (T
A
70°C)
DFN-S .......................................................... Note 2
MSOP..........................................................340 mW
PDIP ............................................................730 mW
SOIC............................................................470 mW
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V  V
DD
18V.
Parameters Sym Min Typ Max Units Conditions
Input
Logic ‘1’, High-Input Volt-
age
V
IH
2.4 V
Logic ‘0’, Low-Input Voltage V
IL
——0.8V
Input Current I
IN
–1.0 +1.0 µA 0V V
IN
V
DD
–10 +10
Output
High Output Voltage V
OH
V
DD
– 0.025 V DC Test
Low Output Voltage V
OL
0.025 V DC Test
Output Resistance R
O
—79 I
OUT
= 10 mA, V
DD
= 18V, T
A
= +25°C
—710 0°C T
A
+70°C
—811 -40°C T
A
+85°C
—812 -40°C T
A
+125°C
Peak Output Current I
PK
—1.5AV
DD
= 18V
Latch-Up Protection
Withstand Reverse Current
I
REV
> 0.5 A Duty cycle 2%, t 300 µs
V
DD
= 18V
Switching Time (Note 1)
Rise Time t
R
—2535nsT
A
= +25°C
—2740 0°C T
A
+70°C
—2940 -40°C T
A
+85°C
—3040 -40°C T
A
+125°C, Figure 4-1
Fall Time t
F
—2535nsT
A
=+25°C
—2740 0°C T
A
+70°C
—2940 -40°C T
A
+85°C
—3040 -40°C T
A
+125°C, Figure 4-1
Delay Time t
D1
—3035nsT
A
=+25°C
—3340 0°C T
A
+70°C
—3545 -40°C T
A
+85°C
—3850 -40°C T
A
+125°C, Figure 4-1
Note 1: Switching times ensured by design.
2: Package power dissipation is dependent on the copper pad area on the PCB.