Datasheet

TC4426A/TC4427A/TC4428A
DS20001423H-page 8  2002-2013 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
3.1 Inputs A and B (IN A, IN B)
MOSFET driver inputs A and B are high-impedance,
TTL/CMOS compatible inputs. These inputs also have
300 mV of hysteresis between the high and low
thresholds that prevents output glitching, even when
the rise and fall time of the input signal is very slow.
3.2 Ground (GND)
The ground pin is the return path for both the bias
current and the high-peak current that discharges the
external load capacitance. The ground pin should be
tied into a ground plane or have a very short trace to the
bias supply source return.
3.3 Output A and B (OUT A, OUT B)
MOSFET driver outputs A and B are low-impedance,
CMOS push-pull style outputs. The pull-down and
pull-up devices are of equal strength, making the rise
and fall times equivalent.
3.4 Supply Input (V
DD
)
The V
DD
input is the bias supply for the MOSFET driver
and is rated for 4.5V to 18V, with respect to the ground
pin. The V
DD
input should be bypassed with local
ceramic capacitors. The value of these capacitors
should be chosen based on the capacitive load that is
being driven.
3.5 Exposed Metal Pad (EP)
The exposed metal pad of the 6x5 DFN-S package is
not internally connected to any potential. Therefore,
this pad can be connected to a ground plane or other
copper plane on a printed circuit board, to aid in heat
removal from the package.
TABLE 3-1: PIN FUNCTION TABLE (Note 1)
Symbol Description
PDIP, MSOP, SOIC 6x5 DFN-S
1 1 NC No connection
2 2 IN A Input A
3 3 GND Ground
4 4 IN B Input B
5 5 OUT B Output B
66V
DD
Supply input
7 7 OUT A Output A
8 8 NC No connection
— 9 EP Exposed Metal Pad
Note 1: Duplicate pins must be connected for proper operation.