Datasheet

 2002-2013 Microchip Technology Inc. DS20001420F-page 19
TC4421/TC4422
APPENDIX A: REVISION HISTORY
Revision F (August 2013)
The following is the list of modifications:
1. Updated package type for 8-Pin 6x5 DFN-S in
Package Types
(1)
.
2. Updated the values in Temperature
Characteristics.
3. Updated the markings in Section 5.0, Packaging
Information.
4. Replaced all references to DFN and SOIC with
DFN-S and SOIJ, respectively.
Revision E (December 2012)
• Added a note to each package outline drawing.