Datasheet

TC1413/TC1413N
DS21392D-page 12  2001-2012 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
D
A
A1
L
c
(F)
A2
E1
E
p
B
n 1
2
Dimens ions D and E 1 do not include mold flash or protrus ions. Mold flash or protrusions s hall not
.037 R E FFFootprint (R eference)
exceed .010" (0.254mm) per side.
Notes:
Drawin
g
No. C04-111
*C ontrolling P a rame te r
Mold Draft Angle Top
Mold Dra ft A ngle B ottom
F oot Angle
Lead Width
Lead Thickness
c
B
.003
.009
.006
.012
Dimens ion Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
F oot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016 .024
.118 BS C
.118 BS C
.000
.030
.193 BS C
.033
MIN
p
n
Units
.026 BS C
NOM
8
INC HE S
0.95 R EF
-
-
.009
.016
0.08
0.22
0˚
0.23
0.40
8˚
MILLIMETE R S*
0.65 BS C
0.85
3.00 BS C
3.00 BS C
0.60
4.90 BS C
.043
.031
.037
.006
0.40
0.00
0.75
MIN
MAX NOM
1.10
0.80
0.15
0.95
MAX
8
--
-
15˚5˚ -
15˚5˚ -
JE DE C E quivalent: MO-187
0˚ - 8˚
5˚
5˚ -
-
15˚
15˚
--
-
-
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging