Datasheet
Table Of Contents
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: Quiescent Supply Current vs. Supply Voltage.
- FIGURE 2-2: Input Threshold vs. Supply Voltage.
- FIGURE 2-3: High-State Output Resistance vs. Supply Voltage.
- FIGURE 2-4: Quiescent Supply Current vs. Temperature.
- FIGURE 2-5: Input Threshold vs. Temperature.
- FIGURE 2-6: Low-State Output Resistance vs. Supply Voltage.
- FIGURE 2-7: Rise Time vs. Supply Voltage.
- FIGURE 2-8: Propagation Delay vs. Supply Voltage.
- FIGURE 2-9: Rise and Fall Times vs. Capacitive Load.
- FIGURE 2-10: Fall Time vs. Supply Voltage.
- FIGURE 2-11: Propagation Delay vs. Supply Voltage.
- FIGURE 2-12: Propagation Delays vs. Capacitive Load.
- 3.0 Pin Descriptions
- 4.0 Applications Information
- 5.0 PAckaging Information
- 6.0 Revision History
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2001-2012 Microchip Technology Inc. DS21389D-page 9
TC1410/TC1410N
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
XXXXXXXX
XXXXXNNN
YYWW
8-Lead PDIP (300 mil)
Example:
TC1410
CPA057
0346
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
NNN
TC1410
COA0346
057
8-Lead MSOP
Example:
XXXXXXX
YWWNNN
1410NE
346057
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
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