Datasheet
Table Of Contents
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: Quiescent Supply Current vs. Supply Voltage.
- FIGURE 2-2: Input Threshold vs. Supply Voltage.
- FIGURE 2-3: High-State Output Resistance vs. Supply Voltage.
- FIGURE 2-4: Quiescent Supply Current vs. Temperature.
- FIGURE 2-5: Input Threshold vs. Temperature.
- FIGURE 2-6: Low-State Output Resistance vs. Supply Voltage.
- FIGURE 2-7: Rise Time vs. Supply Voltage.
- FIGURE 2-8: Propagation Delay vs. Supply Voltage.
- FIGURE 2-9: Rise and Fall Times vs. Capacitive Load.
- FIGURE 2-10: Fall Time vs. Supply Voltage.
- FIGURE 2-11: Propagation Delay vs. Supply Voltage.
- FIGURE 2-12: Propagation Delays vs. Capacitive Load.
- 3.0 Pin Descriptions
- 4.0 Applications Information
- 5.0 PAckaging Information
- 6.0 Revision History
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2001-2012 Microchip Technology Inc. DS21389D-page 11
TC1410/TC1410N
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
Foot Angle
048048
1512015120
Mold Draft Angle Bottom
1512015120
Mold Draft Angle Top
0.510.420.33.020.017.013BLead Width
0.250.230.20.010.009.008
c
Lead Thickness
0.760.620.48.030.025.019LFoot Length
0.510.380.25.020.015.010hChamfer Distance
5.004.904.80.197.193.189DOverall Length
3.993.913.71.157.154.146
E1
Molded Package Width
6.206.025.79.244.237.228EOverall Width
0.250.180.10.010.007.004A1Standoff §
1.551.421.32.061.056.052A2Molded Package Thickness
1.751.551.35.069.061.053AOverall Height
1.27.050
p
Pitch
88
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
D
n
p
B
E
E1
h
L
c
45
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging