Datasheet
Table Of Contents
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: Quiescent Supply Current vs. Supply Voltage.
- FIGURE 2-2: Input Threshold vs. Supply Voltage.
- FIGURE 2-3: High-State Output Resistance vs. Supply Voltage.
- FIGURE 2-4: Quiescent Supply Current vs. Temperature.
- FIGURE 2-5: Input Threshold vs. Temperature.
- FIGURE 2-6: Low-State Output Resistance vs. Supply Voltage.
- FIGURE 2-7: Rise Time vs. Supply Voltage.
- FIGURE 2-8: Propagation Delay vs. Supply Voltage.
- FIGURE 2-9: Rise and Fall Times vs. Capacitive Load.
- FIGURE 2-10: Fall Time vs. Supply Voltage.
- FIGURE 2-11: Propagation Delay vs. Supply Voltage.
- FIGURE 2-12: Propagation Delays vs. Capacitive Load.
- 3.0 Pin Descriptions
- 4.0 Applications Information
- 5.0 PAckaging Information
- 6.0 Revision History
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TC1410/TC1410N
DS21389D-page 10 2001-2012 Microchip Technology Inc.
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
E
eB
c
E1
n
D
1
2
Units INCHES* MILLIMETERS
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins
n
88
Pitch
p
.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width
E1
.240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness
c
.008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top
51015 51015
Mold Draft Angle Bottom
51015 51015
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
JEDEC Equivalent: MS-001
Drawing No. C04-018
.010” (0.254mm) per side.
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging