Datasheet

© 2008 Microchip Technology Inc. DS21949C-page 33
TC1303A/1303B/1303C/1304
APPENDIX A: REVISION HISTORY
Revision C (December 2008)
The following is the list of modifications:
1. Updated Package Types diagram and
Section 3.0 “Pin Descriptions” to show the
Exposed Thermal Pad (EP) information.
2. Updated Section 6.0 “Packaging Informa-
tion”.
Revision B (July 2005)
The following is the list of modifications:
1. Added information on TC1303A, TC1303C and
TC1304 throughout data sheet.
Revision A (June 2005)
• Original Release of this Document.