Datasheet

© 2007 Microchip Technology Inc. DS21335E-page 3
TC1014/TC1015/TC1185
TEMPERATURE CHARACTERISTICS
Output Noise
eN
—600—nV/√Hz —I
L
= I
OUTMAX
,
F = 10 kHz
470 pF from Bypass
to GND
SHDN Input High Threshold
V
IH
45 — — %V
IN
—V
IN
= 2.5V to 6.5V
SHDN Input Low Threshold
V
IL
——15%V
IN
—V
IN
= 2.5V to 6.5V
TC1014/TC1015/TC1185 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Specifications: V
IN
= V
R
+ 1V, I
L
= 100 µA, C
L
= 1.0 µF, SHDN > V
IH
, T
A
= +25°C, unless otherwise noted.
Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameter Symbol Min Typ Max Units Device Test Conditions
Note 1: The minimum V
IN
has to meet two conditions: V
IN
≥ 2.7V and V
IN
≥ V
R
+ V
DROPOUT
.
2: V
R
is the regulator output voltage setting. For example: V
R
= 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.
3:
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V
differential.
6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a current pulse equal to I
LMAX
at V
IN
= 6V for T = 10 ms.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., T
A
, T
J
, θ
JA
). Exceeding the maximum allowable power dissipation causes the device to
initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.
8: Apply for Junction Temperatures of -40°C to +85°C.
TC V
OUT
= (V
OUTMAX
– V
OUTMIN
)x 10
6
V
OUT
x ΔT
Electrical Specifications: V
IN
= V
R
+ 1V, I
L
= 100 µA, C
L
= 1.0 µF, SHDN > V
IH
, T
A
= +25°C, unless otherwise noted.
Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges:
Extended Temperature Range T
A
-40 — +125 °C
Operating Temperature Range T
A
-40 — +125 °C
Storage Temperature Range T
A
-65 — +150 °C
Thermal Package Resistances:
Thermal Resistance, 5L-SOT-23 θ
JA
— 256 — °C/W