Datasheet

©2011 Silicon Storage Technology, Inc. DS25041A 05/11
35
8 Mbit (x16) Multi-Purpose Flash Plus
SST39VF801C / SST39VF802C / SST39LF801C / SST39LF802C
Data Sheet
A
Microchip Technology Company
Packaging Diagrams
Figure 27:48-lead Thin Small Outline Package (TSOP) 12mm x 20mm
SST Package Code: EK
1.05
0.95
0.70
0.50
18.50
18.30
20.20
19.80
0.70
0.50
12.20
11.80
0.27
0.17
0.15
0.05
48-tsop-EK-8
Note: 1. Complies with JEDEC publication 95 MO-142 DD dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
1.20
max.
1mm
0°- 5°
DETAIL
Pin # 1 Identifier
0.50
BSC