Datasheet

©2011 Silicon Storage Technology, Inc. DS25008A 08/11
2
64 Mbit Multi-Purpose Flash Plus
SST39VF6401B / SST39VF6402B
Not Recommended for New Designs
A
Microchip Technology Company
Product Description
The SST39VF640xB devices are 4M x16 CMOS Multi-Purpose Flash Plus (MPF+) manufactured with
SST’s proprietary, high-performance CMOS SuperFlash technology. The split-gate cell design and
thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate
approaches. The SST39VF640xB write (Program or Erase) with a 2.7-3.6V power supply. These
devices conform to JEDEC standard pin assignments for x16 memories.
Featuring high performance Word-Program, the SST39VF640xB devices provide a typical Word-Pro-
gram time of 7 µsec. These devices use Toggle Bit or Data# Polling to indicate the completion of Pro-
gram operation. To protect against inadvertent write, they have on-chip hardware and Software Data
Protection schemes. Designed, manufactured, and tested for a wide spectrum of applications, these
devices are offered with a guaranteed typical endurance of 100,000 cycles. Data retention is rated at
greater than 100 years.
The SST39VF640xB devices are suited for applications that require convenient and economical updat-
ing of program, configuration, or data memory. For all system applications, they significantly improve
performance and reliability, while lowering power consumption. They inherently use less energy during
Erase and Program than alternative flash technologies. The total energy consumed is a function of the
applied voltage, current, and time of application. Since for any given voltage range, the SuperFlash
technology uses less current to program and has a shorter erase time, the total energy consumed dur-
ing any Erase or Program operation is less than alternative flash technologies. These devices also
improve flexibility while lowering the cost for program, data, and configuration storage applications.
The SuperFlash technology provides fixed Erase and Program times, independent of the number of
Erase/Program cycles that have occurred. Therefore the system software or hardware does not have
to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Pro-
gram times increase with accumulated Erase/Program cycles.
To meet high-density, surface mount requirements, the SST39VF640xB devices are offered in 48-lead
TSOP and 48-ball TFBGA packages. See Figures and 2 for pin assignments.