Datasheet

SST26VF064B / SST26VF064BA
DS20005119G-page 56  2015 Microchip Technology Inc.
Microchip Technology Drawing C04-172A Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
8-Lead Very, Very Thin Small Outline No-Lead (MN) - 6x8 mm Body [WDFN]
Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Length
Terminal Length
Exposed Pad Width
Exposed Pad Length
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E2
D2
A3
e
L
E
N
1.27 BSC
0.20 REF
0.45
0.35
0.70
0.00
0.40
6.00 BSC
0.50
4.80 BSC
6.00 BSC
0.75
0.02
8.00 BSC
MILLIMETERS
MIN
NOM
8
0.55
0.45
0.80
0.05
MAX
K-0.20 -
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
3.
Notes:
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
(Also Called WSON)
2.
Terminal 1 visual index feature may vary, but must be located within the hatched area.