Datasheet

SST26VF064B / SST26VF064BA

DS20005119G-page 44  2015 Microchip Technology Inc.

6.0 ELECTRICAL SPECIFICATIONS

Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maxi-

mum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and func-

tional operation of the device at these conditions or conditions greater than those defined in the operational

sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may

affect device reliability.)

Tem p e r a ture Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C

D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to V

+0.5V

Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . -2.0V to V

+2.0V

Package Power Dissipation Capability (T

= 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W

Surface Mount Solder Reflow Te m p era t ure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds

Output Short Circuit Current

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA

1. Output shorted for no more than one second. No more than one output shorted at a time.

TABLE 6-1: OPERATING RANGE

Range Ambient Temp V

Industrial -40°C to +85°C

2.3-3.6V

Extended -40°C to +105°C

TABLE 6-2: AC CONDITIONS OF TEST

1. See Figure 8-5

Input Rise/Fall Time Output Load

3ns C

= 30 pF