User manual

8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USERS GUIDE
© 2005 Microchip Technology Inc. DS51544A-page 27
Appendix B. Bill of Materials (BOM)
TABLE B-1: BILL OF MATERIALS
Qty Reference Description Manufacturer Part Number
1 PCB 103-00050 SOT23 Evaluation Board PCB Microchip
Technology Inc.
103-00060
0 U1 SOIC-8 Device Microchip
Technology Inc.
User-specified
0 U2 MSOP-8 Device Microchip
Technology Inc.
User-specified
0 U3 DIP-8 Device Microchip
Technology Inc.
User-specified
0 U4 TSSOP-8 Device Microchip
Technology Inc.
User-specified
0 C1, C2, C3 Device Power Supply Bypass Capacitor
Surface-mount (805 package)
(Optional - Application-dependent)
User-specified
0 C1A, C1B, C1C,
C1D, C1E, C1F,
C1G, C1H
Output Filer Capacitor
Surface-mount (805 package)
(Optional - Application-dependent)
User-specified
0 R1A, R1B, R1C,
R1D, R1E, R1F,
R1G, R1H
Output inline resistor
Surface-mount (805 package)
(Optional - Application-dependent)
User-specified
0 R2A, R2B, R2C,
R2D, R2E, R2F,
R2G, R2H
Output Pull-up resistor
Surface-mount (805 package)
(Optional - Application-dependent)
User-specified
0 R3A, R3B, R3C,
R3D, R3E, R3F,
R3G, R3H
Output Pull-down resistor
Surface-mount (805 package)
(Optional - Application-dependent)
User-specified
0 P1, P2, P3, P4 Passive component (not connected) that can be
“blue wired” into the desired circuit. The device
layout supports the 805 package.
(Optional - Application-dependent)
0 J1 BFMP Header (6-pin, 100 mil spacing)
0 PAD1, PAD2, PAD3,
PAD4, PAD5, PAD6,
PAD7, PAD8,
V
DD
, V
SS
Through-hole connector(s) for PAD1, PAD2,
PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, V
DD
,
V
SS
Keystone
Electronics
®
5012
0 PAD1, PAD2, PAD3,
PAD4, PAD5, PAD6,
PAD7, PAD8,
V
DD
, V
SS
Surface-mount connector(s) for PAD1, PAD2,
PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, V
DD
,
V
SS
Keystone
Electronics
®
5016