8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide © 2005 Microchip Technology Inc.
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8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Table of Contents Preface ........................................................................................................................... 1 Chapter 1. Product Overview ........................................................................................ 5 1.1 Introduction ..................................................................................................... 5 1.2 What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board? ....
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide NOTES: DS51544A-page iv © 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Represents Referenced books Emphasized text Examples MPLAB® IDE User’s Guide ...is the only compiler...
Preface CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.
-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide NOTES: DS51544A-page 4 © 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board and covers the following topics: • What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board? • What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board kit includes 1.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide NOTES: DS51544A-page 6 © 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Chapter 2. Installation and Operation 2.1 INTRODUCTION This blank Printed Circuit Board (PCB) allows any 8-pin device in the following four package types to be installed: 1. 2. 3. 4. SOIC-8 PDIP-8 MSOP-8 TSSOP-8 This board is generic so that any device may be installed. Refer to the device data sheet, however, for suitability of device evaluation.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide 2.3 GETTING STARTED The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board is a blank PCB that allows the user to configure the circuit to the exact requirements. The passive components use the surface-mount 805 package layout.
Installation and Operation (3) PAD1 R1A* R2A* R2H* R3A* R3H* C1H* C1A* (3) PAD2 R1B* R2B* R2G* R3B* R3G* C1B* 1 8 2 7 3 6 4 R2C* (3) PAD3 R1C* UX 5 R2F* R3F* R3C* R3E* C2 (2) C1D* To power plane C1 (2) To ground plane VDD VSS VDD C3 (2) FIGURE 2-1: R1E* (3) PAD5 C1E* VSS P1 (1) TP11 TP13 TP12 P2 (1) TP14 P3 (1) TP15 TP17 * Note 1: 2: 3: PAD6 R2E* R3D* VSS R1F* (3) C1F* R2D* VDD R1G* (3) PAD7 C1G* C1C* (3) PAD4 R1D* R1H* (3) PAD8 TP16 P4 (1) TP18 Optional
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide 2.3.1 The Hardware Figure 2-2 shows the layout of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. This is a small four-layer board (1.5" x 2" (38.1 mm x 50.8 mm)). There are ten connection points/pads that can use either through-hole or surface-mount connector posts. The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS is connected to the PCB ground plane.
Installation and Operation TABLE 2-1: OPTIONAL PASSIVE COMPONENTS Device C1 Comment Power supply bypass capacitor C2, C3 Device Filtering capacitor C1A, C1B C1C, C1D, C1E, C1F, C1G, C1H Output filter capacitor R1A, R1B, R1C, R1D, R1E, R1F, R1G, R1H In-line resistance of device output R2A, R2B, R2C, R2D, R2E, R2F, R2G, R2H Pull-up resistor R3A, R3B, R3C, R3D, R3E, R3F, R3G, R3H Pull-down resistor P1, P2, P3, P4 Optional Passive Components © 2005 Microchip Technology Inc.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide 2.4 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD DESCRIPTION The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCB is designed to be flexible in the type of device evaluation that can be implemented. The following sections describe each element of this evaluation board in further detail. Refer to Figure 2-3. 2.4.1 Power and Ground The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board has a VDD Pad and a VSS pad.
Installation and Operation 2.4.3 Passive Components (R1X, R2X, R3X, C1X, R1, R2, C1, C2, C3, P1, P2, P3 and P4) The footprints for these components are present to allow maximum flexibility in the use of this PCB to evaluate a wide range of SOT-23-3 devices. The purpose of these components may vary depending on the device under evaluation and how it is to be used in the desired circuit. Refer to the device data sheet for the recommended components that should be used when evaluating that device.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide 2.4.5 Baseline Flash Microcontroller Programmer (BFMP) Interface (Header J1) The BFMP interface allows a PICmicro MCU device to be programmed with programmers that support this interface, such as the BFMP programmer (part number PG164101). The PCB supports two device pinouts. The default pinout already has the traces connected to the appropriate PICmicro MCU pins.
Installation and Operation 2.4.6 The PCB as a SOIC-8, MSOP-8, or TSSOP-8 to DIP-8 Socket Converter There may be occasions when it is desireable to convert the footprint of the device to that of a DIP package. This allows the device to be installed into an exsisting DIP socket. Two 1x4 row pins need to be installed into the PCB’s DIP footprint when the device is installed into the appropriate package footprint.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide A typical system that would be used to evaluate the voltage supervisor/voltage detector device is shown in Figure 2-7. This also shows an example input and output waveform for a voltage supervisor/voltage detector device.
Installation and Operation 2.4.8 Example Op Amp Circuits This section shows how the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board could be used to evaluate op amp circuits. The first circuit is for the MCP601 and is shown in Figure 2-8. Figure 2-9 shows which components on the PCB would be installed and how the “unconnected” passive components would be jumpered into the circuit. The second circuit is for the MCP6021 and is shown in Figure 2-10.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide R1C 3 + 7 2 – 4 R3C R (P1) R1B FIGURE 2-10: 6 Op Amp Circuit #2 (MCP6021). PAD1 PAD8 Trace is cut, resistor is installed PAD2 R1B* PAD7 Trace is cut, resistor is installed 1 8 2 7 3 6 4 PAD3 R1C* 5 U1 R3C* PAD6 P1 PAD4 PAD5 C2 To power plane VDD VSS VDD C1 To ground plane VSS FIGURE 2-11: DS51544A-page 18 PCB Op Amp Circuit #2 (MCP6021). © 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the schematics and layouts for the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. Diagrams included in this appendix: • • • • • • • A.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide FIGURE A-2: DS51544A-page 20 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Schematic. © 2005 Microchip Technology Inc.
Schematic and Layouts FIGURE A-3: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Layout – Top Layer + Bottom Layer + Silk-Screen. © 2005 Microchip Technology Inc.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide FIGURE A-4: DS51544A-page 22 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Top Layer + Silk-Screen. © 2005 Microchip Technology Inc.
Schematic and Layouts FIGURE A-5: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Bottom Layer. © 2005 Microchip Technology Inc.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide FIGURE A-6: DS51544A-page 24 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Power Plane © 2005 Microchip Technology Inc.
Schematic and Layouts FIGURE A-7: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Ground Plane. © 2005 Microchip Technology Inc.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide FIGURE A-8: DS51544A-page 26 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Component Layer. © 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Appendix B.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide NOTES: DS51544A-page 28 © 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Appendix C. Microchip Analog and Interface Device Compatibility C.1 INTRODUCTION This appendix documents the Michrochip Analog and Interface devices that are footprint compatible with this PCB.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide TABLE C-1: Device ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY SOIC DIP MSOP TSSOP Comment Voltage Supervisors and Voltage Detectors TC1232 Yes Yes — — Digital Potentiometer MCP4021 Yes — Yes — MCP41010 Yes Yes — — MCP41050 Yes Yes — — MCP41100 Yes Yes — — Switching Regulator MCP1601 — — Yes — MCP1612 — — Yes — MCP1630 — — Yes — MCP1650 — — Yes — MCP1651 — — Yes — MCP1652 — — Yes — — DC-to-
Microchip Analog and Interface Device Compatibility TABLE C-1: Device ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY SOIC DIP MSOP TSSOP Comment Operational Amplifiers (Op Amps) MCP601 Yes Yes — Yes Note 2 MCP602 Yes Yes — Yes Note 2 Note 2 MCP603 Yes Yes — Yes MCP606 Yes Yes — Yes MCP607 Yes Yes — Yes MCP608 Yes Yes — Yes MCP616 Yes Yes Yes — MCP617 Yes Yes Yes — MCP618 Yes Yes Yes — MCP6001 Yes Yes Yes — MCP6004 Yes Yes Yes — MCP6021 Yes Yes
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide TABLE C-1: Device ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY SOIC DIP MSOP TSSOP Comment Programmable Gain Amplifiers (PGAs) MCP6S21 Yes Yes Yes — Note 2 MCP6S22 Yes Yes Yes — Note 2 MCP6S91 Yes Yes Yes — Note 2 MCP6S92 Yes Yes Yes — Note 2 Power MOSFET Drivers TC1410 Yes Yes Yes — TC1410N Yes Yes Yes — TC1411 Yes Yes Yes — TC1411N Yes Yes Yes — TC1426 Yes Yes — — TC1427 Yes Yes — — TC1428
Microchip Analog and Interface Device Compatibility TABLE C-1: Device ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY SOIC DIP MSOP TSSOP MCP6541 Yes Yes Yes — MCP6542 Yes Yes Yes — MCP6543 Yes Yes Yes — MCP6546 Yes Yes Yes — MCP6547 Yes Yes Yes — Comment Comparators MCP6548 Yes Yes Yes — TC1025 Yes Yes Yes — TC1028 — — Yes — TC1031 — — Yes — TC1040 — — Yes — TC1041 Yes — Yes — A/D Converters (ADCs) MCP3001 Yes Yes — Yes MCP3002 Yes Yes —
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide TABLE C-1: Device ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY SOIC DIP MSOP TSSOP Comment Temperature Sensors MCP9801 Yes — Yes — MCP9803 Yes — Yes — TC72 — — Yes — TCN75 Yes — Yes — TC620 Yes Yes — — TC621 Yes Yes — — TC622 Yes Yes — — TC623 Yes Yes — — TC624 Yes Yes — — Fan Controllers TC642 Yes Yes Yes — TC642B Yes Yes Yes — TC646 Yes Yes Yes — TC646B Yes Yes Yes — TC647 Yes
8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Appendix D. Rev. 1 PCB Errata D.1 INTRODUCTION This appendix documents the issues with the Rev 1 PCB. The Rev 2 PCB fixes these issues. D.2 REV 1 PCB ISSUES There are two issues with the Rev 1 PCB. These are: 1. VDD and VSS vias near each pad are No Connects (they should have been connected to the appropriate power or ground plane). See Figure D-1 shows the location of these vias that are No Connects.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide This indicates a Rev 1 PCB FIGURE D-2: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Revision Marking (Gerber – Bottom Layer) DS51544A-page 36 © 2005 Microchip Technology Inc.
Rev. 1 PCB Errata Figure D-3 shows how the pad can be connected to either the VDD or VSS plane of the PCB. Jumpering to VSS FIGURE D-3: © 2005 Microchip Technology Inc. Jumpering to VDD Alternate Jumpering the PCB pad to either VSS or VDD.
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