User manual

14-PIN SOIC/DIP/TSSOP
EVALUATION BOARD USER’S GUIDE
© 2006 Microchip Technology Inc. DS51597A-page 27
Appendix B. Bill Of Materials (BOM)
TABLE B-1: BILL OF MATERIALS
Qty Reference Description Manufacturer Part Number
1 PCB 103-00094 SOT23 Evaluation Board PCB Microchip
Technology Inc.
103-00094
0 U1 DIP-14 Device Microchip
Technology Inc.
User-specified
0 U2 SOIC-14 Device Microchip
Technology Inc.
User-specified
0 U3 SOT-23-6 Device Microchip
Technology Inc.
User-specified
0 U4 TSSOP-14 Device Microchip
Technology Inc.
User-specified
0 C2, C3, C4 Device Power Supply Bypass Capacitor
Surface-mount (805 package)
(Optional - Application-dependent)
— User-specified
0 C1A, C1B, C1C, C1D,
C1E, C1F, C1G, C1H,
C1J, C1K, C1L, C1M,
C1N, C1P
Output Filer Capacitor
Surface-mount (805 package)
(Optional - Application-dependent)
— User-specified
0 R1A, R1B, R1C, R1D,
R1E, R1F, R1G, R1H,
R1J, R1K, R1L, R1M,
R1N, R1P
Output inline resistor
Surface-mount (805 package)
(Optional - Application-dependent)
— User-specified
0 R2A, R2B, R2C, R2D,
R2E, R2F, R2G, R2H,
R2J, R2K, R2L, R2M,
R2N, R2P
Output Pull-up resistor
Surface-mount (805 package)
(Optional - Application-dependent)
— User-specified
0 R3A, R3B, R3C, R3D,
R3E, R3F, R3G, R3H,
R3J, R3K, R3L, R3M,
R3N, R3P
Output Pull-down resistor
Surface-mount (805 package)
(Optional - Application-dependent)
— User-specified
0 P1, P2, P3, P4, P5,
P6, P7, P8
Passive component (not connected) that can
be “blue wired” into the desired circuit. The
device layout supports the 805 package.
(Optional - Application-dependent)
——
0 H1 BFMP Header (6-pin, 100 mil spacing) — —
0 J1, J2 1x3 Jumper Stakes (male) Jameco
ValuePro
7000-1x35G
0 J3, J4, J5, J6 1x2 Jumper Stakes (male) Jameco
ValuePro
7000-1x25G
0 PAD1, PAD2, PAD3,
PAD4, PAD5, PAD6,
PAD7, PAD8, PAD9,
PAD10, PAD11,
PAD12, PAD13,
PAD14, VDD, VSS
Through-hole connectors Keystone
Electronics
®
5012