User manual

Installation and Operation

2.4 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD DESCRIPTION

The 14-Pin SOIC/DIP/TSSOP Evaluation Board PCB is designed to be flexible in the

type of device evaluation that can be implemented.

The following sections describe each element of this evaluation board in further detail.

Refer to Figure 2-4.

2.4.1 Power and Ground

The 14-Pin SOIC/DIP/TSSOP Evaluation Board has a VDD pad and a VSS pad. These

pads can have connection posts installed that allow easy connection to the power

(VDD) and ground (VSS) planes. The layout allows either through-hole or

surface-mount connectors.

The power and ground planes are connected to the appropriate passive components

on the PCB (such as power plane to R2X and ground plane to R3X and C1X).

2.4.2 PCB PADs

For each package pin (pins 1 to 14), there is a PCB pad (pads 1 to 14). The device will

have some power pins (VDD) and some ground pins (VSS). To ease connections on

the PCB, vias to the power and ground plane have been installed close to each PCB

pad. This allows any pad to be connected to the power or ground plane, so when power

is connected to the VDD and VSS pads, the power is connected to the appropriate

device pin.

FIGURE 2-4: Jumpering the PCB pad to either VDD or VSS.

Jumpering to VSS Jumpering to VDD