User manual

14-PIN SOIC/DIP/TSSOP
EVALUATION BOARD USERS GUIDE
© 2006 Microchip Technology Inc. DS51597A-page 7
Chapter 2. Installation and Operation
2.1 INTRODUCTION
This blank Printed Circuit Board allows any 14-pin device in the following four package
types to be installed:
1. SOIC-14
2. PDIP-14
3. TSSOP-14
This board is generic so that any device may be installed. Refer to the device data
sheet, however, for suitability of device evaluation.
As well as the device, other desired passive components (resistors and capacitors) and
connection posts may be installed. This allows the board to evaluate a minimum
configuration for the device. Also, this allows the device to easily be jumpered into an
existing system.
2.2 FEATURES
The 14-Pin SOIC/DIP/TSSOP Evaluation Board has the following features:
Connection terminals may be either through-hole or surface-mount
Three 14-pin package footprints supported:
-SOIC
-DIP
-TSSOP
Footprints for optional passive components and other devices for:
- Power supply filtering
- Device bypass capacitor
- Output filtering
- Output pull-up resistor
- Output pull-down resistor
- Output loading resistor
- Output series resistor
- Up to four additional passive components
- Jumper Headers
- SOT-23-6
Silk-screen area to write specifics of implemented circuit (on back of PCB), such
as MCP2120 (to indicate that the device is MCP2120)
•PICmicro
®
MCU Baseline Flash Microcontroller Programmer (BFMP) Header
Can be used for SOIC-14, TSSOP-14 to DIP-14 converter