4-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide © 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Table of Contents Preface ........................................................................................................................... 1 Chapter 1. Product Overview ........................................................................................ 5 1.1 Introduction ..................................................................................................... 5 1.2 What is the 14-Pin SOIC/DIP/TSSOP Evaluation Board? ............
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide NOTES: DS51597A-page iv © 2006 Microchip Technology Inc.
14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number.
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Represents Referenced books Emphasized text Examples MPLAB® IDE User’s Guide ...is the only compiler...
Preface CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide NOTES: DS51597A-page 4 © 2006 Microchip Technology Inc.
14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the 14-Pin SOIC/DIP/TSSOP Evaluation Board and covers the following topics: • What is the 14-Pin SOIC/DIP/TSSOP Evaluation Board? • What the 14-Pin SOIC/DIP/TSSOP Evaluation Board kit includes 1.
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide NOTES: DS51597A-page 6 © 2006 Microchip Technology Inc.
14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Chapter 2. Installation and Operation 2.1 INTRODUCTION This blank Printed Circuit Board allows any 14-pin device in the following four package types to be installed: 1. SOIC-14 2. PDIP-14 3. TSSOP-14 This board is generic so that any device may be installed. Refer to the device data sheet, however, for suitability of device evaluation. As well as the device, other desired passive components (resistors and capacitors) and connection posts may be installed.
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide 2.3 GETTING STARTED The 14-Pin SOIC/DIP/TSSOP Evaluation Board is a blank PCB that allows the user to configure the circuit to the exact requirements. The passive components use the surface-mount 805 package layout. Figure 2-1 shows the evaluation board circuit. Pin “n” of each device (U1, U2 and U4) is tied together. These pins are then connected with pad “n” of the PCB (through a circuit).
M Installation and Operation FIGURE 2-1: 14-Pin SOIC/DIP/TSSOP Evaluation Board Circuit (Page 1). © 2006 Microchip Technology Inc.
M 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide FIGURE 2-2: DS51597A-page 10 14-Pin SOIC/DIP/TSSOP Evaluation Board Circuit (Page 2) © 2006 Microchip Technology Inc.
Installation and Operation 2.3.1 The Hardware Figure 2-3 shows the layout of the 14-Pin SOIC/DIP/TSSOP Evaluation Board. This is a small four-layer board (3.55" x 1.79" (9.02 mm x 4.55 mm)). There are sixteen connection points/pads that can use either through-hole or surface-mount connector posts. The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS is connected to the PCB ground plane.
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide TABLE 2-1: OPTIONAL PASSIVE COMPONENTS Device C2 DS51597A-page 12 Comment Power supply bypass capacitor C3, C4 Device filtering capacitor C1A, C1B, C1C, C1D, C1E, C1F, C1G, C1H, C1J, C1K, C1L, C1M, C1N, C1P Output filter capacitor R1A, R1B, R1C, R1D, R1E, R1F, R1G, R1H, R1J, R1K, R1L, R1M, R1N, R1P In-line resistance of device output R2A, R2B, R2C, R2D, R2E, R2F, R2G, R2H, R2J, R2K, R2L, R2M, R2N, R2P Pull-up resistor R3A, R3B, R3C, R3D, R3E,
Installation and Operation 2.4 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD DESCRIPTION The 14-Pin SOIC/DIP/TSSOP Evaluation Board PCB is designed to be flexible in the type of device evaluation that can be implemented. The following sections describe each element of this evaluation board in further detail. Refer to Figure 2-4. 2.4.1 Power and Ground The 14-Pin SOIC/DIP/TSSOP Evaluation Board has a VDD pad and a VSS pad.
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide 2.4.3 Passive Components (R1X, R2X, R3X, C1X, R1, R2, C1, C2, C3, P1, P2, P3 and P4) The footprints for these components are present to allow maximum flexibility in the use of this PCB to evaluate a wide range of 14-pin SOIC, DIP and TSSOP devices. The purpose of these components may vary depending on the device under evaluation and how it is to be used in the desired circuit.
Installation and Operation 2.4.5 Baseline Flash Microcontroller Programmer (BFMP) Interface (Header J1) The BFMP interface allows a PICmicro MCU device to be programmed with programmers that support this interface, such as the BFMP programmer (part number PG164101).
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide 2.4.6 The PCB as a SOIC-14 or TSSOP-14 to DIP-14 Socket Converter There may be occasions when it is desirable to convert the footprint of the device to that of a DIP package. This allows the device to be installed into an existing DIP socket. Two 1x7 row pins need to be installed into the PCB’s DIP footprint when the device is installed into the appropriate package footprint.
14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the schematics and layouts for the 14-Pin SOIC/DIP/TSSOP Evaluation Board. Diagrams included in this appendix: • • • • • • • A.
M 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide FIGURE A-2: DS51597A-page 18 Board Schematic - Digital Circuitry (Page 1). © 2006 Microchip Technology Inc.
M Schematic and Layouts FIGURE A-3: Board Schematic - Digital Circuitry (Page 2). © 2006 Microchip Technology Inc.
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide FIGURE A-4: DS51597A-page 20 Board Layout – Top Layer + Bottom Layer + Silk-Screen. © 2006 Microchip Technology Inc.
Schematic and Layouts FIGURE A-5: Board Layout – Top Layer + Silk-Screen. © 2006 Microchip Technology Inc.
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide FIGURE A-6: DS51597A-page 22 Board Layout – Bottom Layer. © 2006 Microchip Technology Inc.
Schematic and Layouts FIGURE A-7: Board Layout – Power Plane. © 2006 Microchip Technology Inc.
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide FIGURE A-8: DS51597A-page 24 Board Layout – Ground Plane. © 2006 Microchip Technology Inc.
Schematic and Layouts FIGURE A-9: Board Layout – Component Layer. © 2006 Microchip Technology Inc.
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide FIGURE A-10: DS51597A-page 26 Board Layout – Bottom Silk. © 2006 Microchip Technology Inc.
14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Appendix B.
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide TABLE B-1: Qty 0 0 BILL OF MATERIALS (CONTINUED) Reference PAD1, PAD2, PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, PAD9, PAD10, PAD11, PAD12, PAD13, PAD14, VDD, VSS S1, S2 DS51597A-page 28 Description Manufacturer Part Number Surface-mount connectors Keystone Electronics® 5016 Surface Mount Switch Panasonic® EVQ-PJS04K © 2006 Microchip Technology Inc.
14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Appendix C. Microchip Analog and Interface Device Compatibility C.1 INTRODUCTION This appendix documents the Microchip Analog and Interface devices that are footprint compatible with the 14-Pin SOIC/DIP/TSSOP Evaluation Board.
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide TABLE C-1: Device ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY(1, 2) SOIC DIP TSSOP Comment Digital Potentiometer MCP42010 Yes Yes — MCP42050 Yes Yes — MCP42100 Yes Yes — Operational Amplifiers (Op Amps) MCP604 Yes Yes Yes MCP609 Yes Yes Yes MCP619 Yes Yes Yes MCP6004 Yes Yes Yes MCP6024 Yes Yes Yes MCP6044 Yes Yes Yes MCP6144 Yes Yes Yes MCP6234 Yes Yes Yes MCP6244 Yes Yes Yes MCP6274 Yes Yes Yes
Microchip Analog and Interface Device Compatibility TABLE C-1: ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY(1, 2) (CONTINUED) Device SOIC DIP TSSOP MCP2120 Yes Yes — MCP25020 Yes Yes — MCP25025 Yes Yes — MCP25050 Yes Yes — MCP25055 Yes Yes — PIC16F505 Yes Yes Yes PIC16F630 Yes Yes Yes PIC16F636 Yes Yes Yes PIC16F676 Yes Yes Yes PIC16F684 Yes Yes Yes PIC16F688 Yes Yes Yes Comment Interface Devices ® PICmicro MCU’s Voltage Supervisors and Voltage Detecto
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