User's Manual

www.rovingnetworks.com Version 1.1 3/19/13 page 11
Advanced Information
RN52-DS
2.5 Solder Reflow Profile
The lead-free solder reflow temperature and times are:
• Temperature—230° C, 60 seconds maximum,
peak 245° C maximum
• Preheat temperature—165° ± 15° C, 90 to 120
seconds
• Time—Single pass, one time
To reflow solder the module onto a PCB, use an RoHS-
compliant solder paste equivalent to NIHON ALMIT
paste or OMNIX OM-310 solder paste from Alpha met-
als. See Ta ble 2-2 .
Figure 2-5 and Figure 2-6 show the solder reflow tem-
perature profiles.
FIGURE 2-5: SOLDER REFLOW TEMPERATURE PROFILE
Note: Use no-clean flux and DO NOT water
wash
TABLE 2-2: PASTE SOLDER RECOMMENDATIONS
Manufacturer Alpha Metals
http://www.alphametals.com
NIHON ALMIT Co. LTD
http://almit.co.jp
Part Number OMNIX OM-310 LFM-70W INP
Metal Composition SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) 88% Sn, 3.5% Ag, 0.5% Bi, 8% In
Liquidus Temperature ~220°C ~215°C