User's Manual

ManualsBrandsMicrochip Technology ManualsElectronicsClass 2 Bluetooth Module

Table Of Contents

www.rovingnetworks.com Version 1.1 3/19/13 page 1

Advanced Information

RN52-DS

RN52 Bluetooth Audio Module

Features:

• Fully qualified Bluetooth

version 3.0 module,

fully compatible with Bluetooth version 2.1+EDR,

1.2, and 1.1

• Software configurable through commands over

UART console interface

• Dedicated GPIO pins enable MCUs to access

control and status functions efficiently

• Postage-stamp-sized form factor, 13.5 x 26.0 x

2.7 mm

• Embedded Bluetooth stack profiles: A2DP,

AVRCP, HFP/HSP, and SPP

• Dual-channel, differential audio input and output

for highest quality audio

• Supports iAP profile to discover iOS devices and

apps (requires a special firmware build)

• Integrated amplifier for driving 16 Ω speakers

• UART (SPP) data connection interfaces

• External audio CODECs supported via S/PDIF

and I

S interface

• Castellated SMT pads for easy and reliable PCB

mounting

• Environmentally friendly, RoHS compliant

• Certifications: FCC, ICS, CE

• Bluetooth SIG certified

Applications:

• High-quality, 2-channel audio streaming

• Wireless stereo headsets

• Automotive hands free audio

• Wireless audio docking station for smartphones

• Wireless speakers

• Intercom push-to-talk audio connection

• Remote control for media player

• Medical devices

• Computer accessories

RN52 Block Diagram:

PCB Antenna

Bluetooth 3.0

RF Baseband

RN52

UART

USB

S/PDIF

11 GPIO

Pins

1 AIO

16-Bit RISC MCU

Audio DSP

16-Bit Stereo

CODEC

16-MBit Flash

2 LEDs

MIC

Speake

Summary of content (18 pages)

PAGE 1
RN52-DS RN52 Bluetooth Audio Module Features: • Fully qualified Bluetooth® version 3.0 module, fully compatible with Bluetooth version 2.1+EDR, 1.2, and 1.1 • Software configurable through commands over UART console interface • Dedicated GPIO pins enable MCUs to access control and status functions efficiently • Postage-stamp-sized form factor, 13.5 x 26.0 x 2.
PAGE 2
RN52-DS 1.0 DEVICE OVERVIEW Roving Network’s RN52 Bluetooth audio module provides a highly integrated solution for delivering highquality stereo audio in a small form factor. It combines a class 2 Bluetooth radio with an embedded DSP processor. The module is programmed and controlled with a simple ASCII command language. TABLE 1-1: The RN52 module complies with Bluetooth specification version 3.0. It integrates RF, a baseband controller, etc., making it a complete Bluetooth subsystem.
PAGE 3
RN52-DS FIGURE 1-1: MODULE DIMENSIONS (Side View) 0.75 12.75 (Top View) 26.00 26.00 21.40 21.20 20.00 18.80 17.60 16.40 15.20 14.00 12.80 11.60 10.40 9.20 8.00 6.80 5.60 4.40 3.20 2.00 Tolerances: PCB Outline: +/- 0.13 mm PCB Thickness: +/- 0.100 mm 21.40 0.70 0.00 2.70 0.80 0.00 0.00 0.85 2.55 3.75 4.95 6.15 7.35 8.55 9.75 10.95 12.65 13.50 0.0 FIGURE 1-2: Dimensions are in millimeters RECOMMENDED PCB FOOTPRINT 3.25 4.65 6.05 7.45 8.85 10.25 (Top View) 0.8mm 1.6mm 26.00 21.40 20.
PAGE 4
RN52-DS Figure 1-3 shows the pinout and Table 1-4 describes the module’s pins.
PAGE 5
RN52-DS TABLE 1-4: Pin PIN DESCRIPTION (PART 2 OF 3) Note 1 Symbol I/O Type Description Direction Default 6 GPIO5 Bidirectional with programmable strength internal pull-up/down. Programmable I/O. I/O High 7 GPIO12 Bidirectional with programmable strength internal pull-up/down. Programmable I/O. I/O High 8 GPIO13 Bidirectional with programmable strength internal pull-up/down. Programmable I/O. I/O High 9 GPIO11 Bidirectional with programmable strength internal pull-up/down.
PAGE 6
RN52-DS TABLE 1-4: Pin PIN DESCRIPTION (PART 3 OF 3) Note 1 Symbol I/O Type Description Direction Default 27 GND Ground. Ground. 28 SPI_SS CMOS input with weak internal pull-up. Chip select for Synchronous Serial Interface active low. 29 SPI_MISO CMOS output, tri-state, with Serial Peripheral Interface (SPI) output. weak internal pull-down. 30 SPI_CLK Input with weak internal pull-down. SPI clock. Input 31 SPI_MOSI CMOS input, with weak internal pull-down. SPI input.
PAGE 7
RN52-DS FIGURE 1-4: RN52 AUDIO INTERFACE BLOCK DIAGRAM System Mainboard RN52 SPK_L+ SPK_L- Audio PA SPK_R+ SPK_RS/PDIF & I2S MIC_L+ MIC_L- MIC & Bias MIC_R+ MIC_RMIC_BIAS FIGURE 1-5: STEREO CODEC AUDIO INPUT/OUTPUT STAGES Input Amplifier RN52 MIC_L+ ΣΔ-ADC MIC_LOutput Amplifier LP Filter SPK_L+ DAC SPK_LDigital Circuitry Input Amplifier MIC_R+ ΣΔ-ADC MIC_ROutput Amplifier SPK_R+ LP Filter DAC SPK_R- www.rovingnetworks.com Version 1.
PAGE 8
RN52-DS 1.1.2 ANALOG-TO-DIGITAL CONVERTER (ADC) The ADC consists of two second-order sigma delta (SD) converters, resulting in two separate channels with identical functionality. Each ADC supports the following sample rates: • 8 kHz • 11.025 kHz • 16 kHz FIGURE 1-6: • • • • 22.05 kHz 24 kHz 32 kHz 44.1 kHz The ADC analog amplifier is a two-stage amplifier. The first stage selects the correct gain for either microphone or line input. See Figure 1-6.
PAGE 9
RN52-DS 2.0 APPLICATIONS 2.1 The following sections provide information on designing with the RN52 module, including restoring factory defaults, using the LED interface, minimizing radio interference, solder reflow profile, typical application, etc. FIGURE 2-1: Minimizing Radio Interference When laying out the host PCB for the RN52 module, the areas under the antenna and shielding connections should not have surface traces, ground planes, or exposed via (see Figure 2-1).
PAGE 10
RN52-DS 2.2 LED Interface 2.3 The RN52 includes two pads dedicated to driving the LED indicators. The firmware can control both terminals, and the battery charger can set LED0. The terminals are open-drain outputs; therefore, the LED must be connected from a positive supply rail to the pad in series with a current limiting resistor. You should operate the LED pad (LED0 or LED1 pins) with a pad voltage below 0.5 V. In this case, the pad can be thought of as a resistor, RON.
PAGE 11
RN52-DS 2.5 Solder Reflow Profile The lead-free solder reflow temperature and times are: • Temperature—230° C, 60 seconds maximum, peak 245° C maximum • Preheat temperature—165° ± 15° C, 90 to 120 seconds • Time—Single pass, one time TABLE 2-2: To reflow solder the module onto a PCB, use an RoHScompliant solder paste equivalent to NIHON ALMIT paste or OMNIX OM-310 solder paste from Alpha metals. See Table 2-2.
PAGE 12
RN52-DS FIGURE 2-6: SOLDER REFLOW CURVE www.rovingnetworks.com Version 1.
PAGE 13
29 30 31 32 33 34 35 36 37 38 SPI _MI SO SPI _SCK SPI _MOSI L ED1 L ED0 MI C_BI AS MI C_L + MI C_R+ MI C_L - MI C_R- 41 42 43 SPKR_L - SPKR_R+ SPKR_L + 44 40 SPKR_R- 39 28 SPI _SS PCM_CL K PCM_SYNC PCM_OUT PCM_IN 27 GND SPKR_L + SPKR_R+ SPKR_L- SPKR_R- AGND MIC_R- MIC_L- MIC_R+ MIC_L+ MIC_BIAS L ED0 L ED1 SPI_MOSI SPI_SCK SPI_MISO SPI _SS GND 26 PCM_CL K 25 45 L ED1 L ED0 24 3.
PAGE 14
RN52-DS 3.0 REGULATORY APPROVAL This section outlines the regulatory information for the RN52 module for the following countries: • • • • • United States Canada Europe Australia New Zealand 3.1 Contains Transmitter Module FCC ID: T9J-RN52 or Contains FCC ID: T9J-RN52 United States The RN52 module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Part 15.212 Modular Transmitter approval.
PAGE 15
RN52-DS to Radio Frequency Electromagnetic Fields, provides assistance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). The bulletin offers guidelines and suggestions for evaluating compliance.
PAGE 16
RN52-DS The above notice may be affixed to the device instead of displayed in the user manual. 3.2.2 HELPFUL WEB SITES Industry Canada: http://www.ic.gc.ca/ 3.3 Europe The RN52 module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. 3.3.
PAGE 17
RN52-DS TABLE 3-1: EUROPEAN COMPLIANCE TESTING Certification Safety Standards Article Laboratory Report Number Date EN 60950-1:2006+A11:2009+A1:2010 (3.1(a)) Health EN 50371:2002-03 EMC EN 301 489-1 V1.8.1 (2008-04) Radio EN 300 328 V1.7.1 (2006-10) (3.1(b)) EN 301 489-17 V2.1.1 (2009-05) (3.2) Notified Body Opinion DoC 3.4 Australia The Australia radio regulations do not provide a modular approval policy similar to the United States (FCC) and Canada (IC).
PAGE 18
RN52-DS 4.0 ORDERING INFORMATION Table 4-1 provides ordering information for the RN52 module. TABLE 4-1: ORDERING INFORMATION Part Number RN52-I/RM Description Standard application firmware (A2DP/AVRCP/SPP) master and slave). For other configurations, contact Roving Networks directly. Go to http://www.rovingnetworks.com for current pricing and a list of distributors carrying Roving Networks products. 5.0 DOCUMENT REVISION HISTORY 5.1 Version 1.1 • Updated pin information.