User's Manual

 2014 Microchip Technology Inc. DSXXXXXXXXA-page 11
RN4020
FIGURE 7-3: 3D RADIATION PATTERN
AND ANTENNA
ORIENTATION
The lead-free solder reflow temperature and times are:
• Temperature — 230°C, 60 seconds maximum,
peak 245° C maximum
• Preheat temperature — 165° ± 15°C, 90 to 120
seconds
• Time — Single pass, one time
The solder reflow temperature must not exceed 220°C.
To reflow solder the module onto a PCB, Roving Net-
works recommends a RoHS-compli ant solder paste
equivalent to NIHON ALMIT paste or OMNIX OM-310
solder paste from Alpha metals. See Table 7-3
Note: Use no-clean flux and do not water wash.
FIGURE 7-4: SOLDER REFLOW TEMPERATURE PROFILE
TABLE 7-3: PASTE SOLDER RECOMMENDATIONS
Manufacturer
Alpha Metals
http://www.alphametals.com
NIHON ALMIT Co. LTD
http://almit.co.jp
Part Number OMNIX OM-310 LFM-70W INP
Metal Composition SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) 88% Sn, 3.5% Ag, 0.5% Bi, 8% In
Liquidus Temperature ~220°C ~215°C
DRAFT