Datasheet

PIC32MX5XX/6XX/7XX
DS60001156H-page 360  2009-2013 Microchip Technology Inc.
31.1 DC Characteristics
TABLE 31-1: OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD Range
(in Volts)
(1)
Temp. Range
(in °C)
Max. Frequency
PIC32MX5XX/6XX/7XX
DC5 2.3-3.6V -40°C to +85°C 80 MHz
DC5b 2.3-3.6V -40°C to +105°C 80 MHz
Note 1: Overall functional device operation at V
BORMIN < VDD < VDDMIN is tested, but not characterized. All device
Analog modules, such as ADC, etc., will function, but with degraded performance below VDDMIN. Refer to
parameter BO10 in Table 31-10 for BOR values.
TABLE 31-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min. Typical Max. Unit
Industrial Temperature Devices
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range T
A -40 — +85 °C
V-Temp Temperature Devices
Operating Junction Temperature Range T
J -40 — +140 °C
Operating Ambient Temperature Range T
A -40 — +105 °C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD – S IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
I/O = S (({V
DD – VOH} x IOH) + S (VOL x IOL))
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/JA W
TABLE 31-3: THERMAL PACKAGING CHARACTERISTICS
Characteristics Symbol Typical Max. Unit
See
Note
Package Thermal Resistance, 121-Pin TFBGA (10x10x1.1 mm) JA 40 — °C/W 1
Package Thermal Resistance, 100-Pin TQFP (14x14x1 mm) 
JA 43 — °C/W 1
Package Thermal Resistance, 100-Pin TQFP (12x12x1 mm) 
JA 43 — °C/W 1
Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm) 
JA 47 — °C/W 1
Package Thermal Resistance, 64-Pin QFN (9x9x0.9 mm) JA 28 — °C/W 1
Package Thermal Resistance, 124-Pin VTLA (9x9x0.9 mm) 
JA 21 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (JA) numbers are achieved by package simulations.