Datasheet

PIC32MX1XX/2XX
DS61168E-page 244 Preliminary  2011-2012 Microchip Technology Inc.
29.1 DC Characteristics
TABLE 29-1: OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD Range
(in Volts)
(1)
Temp. Range
(in °C)
Max. Frequency
PIC32MX1XX/2XX
DC5 2.3-3.6V -40°C to +85°C 40 MHz
DC5b 2.3-3.6V -40°C to +105°C 40 MHz
Note 1: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. All device
Analog modules, such as ADC, etc., will function, but with degraded performance below V
DDMIN. Refer to
parameter BO10 in Table 29-10 for BOR values.
TABLE 29-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min. Typical Max. Unit
Industrial Temperature Devices
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range TA -40 — +85 °C
V-temp Temperature Devices
Operating Junction Temperature Range T
J -40 — +140 °C
Operating Ambient Temperature Range TA -40 — +105 °C
Power Dissipation:
Internal Chip Power Dissipation:
P
INT = VDD x (IDD – S IOH)
PD PINT + PI/O W
I/O Pin Power Dissipation:
I/O = S (({VDD – VOH} x IOH) + S (VOL x IOL))
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/JA W
TABLE 29-3: THERMAL PACKAGING CHARACTERISTICS
Characteristics Symbol Typical Max. Unit Notes
Package Thermal Resistance, 28-pin SSOP 
JA 71 — °C/W 1
Package Thermal Resistance, 28-pin SOIC 
JA 50 — °C/W 1
Package Thermal Resistance, 28-pin SPDIP 
JA 42 — °C/W 1
Package Thermal Resistance, 28-pin QFN 
JA 35 — °C/W 1
Package Thermal Resistance, 36-pin VTLA 
JA 31 — °C/W 1
Package Thermal Resistance, 44-pin QFN 
JA 32 — °C/W 1
Package Thermal Resistance, 44-pin TQFP 
JA 45 — °C/W 1
Package Thermal Resistance, 44-pin VTLA JA 30 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (JA) numbers are achieved by package simulations.