Information
2009-2013 Microchip Technology Inc. DS80000441J-page 13
PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 and PIC24HJ128GPX02/X04
APPENDIX A: REVISION HISTORY
Rev A Document (3/2009)
Initial release of this document; issued for revision A1,
A2 and A3 silicon.
Includes silicon issues 1-2 (UART), 3-4 (SPI), 5-10
(I
2
C™), 11-12 (UART), 13 (Comparator), 14 (Internal
Voltage Regulator), 15 (PSV Operations), 16-17
(ECAN™), 18 (CPU) and 19 (SPI).
This document replaces the following errata document:
“PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 and
PIC24HJ128GPX02/X04 Rev. A1/A2/A3 Silicon Errata”
(DS80373)
Rev B
Document (4/2009)
Corrected part numbers.
Rev C
Document (8/2009)
Added silicon issue 20 (UART).
Rev D
Document (1/2010)
Added Rev. A4 silicon information.
Rev E
Document (6/2010)
Updated silicon issue 18 (CPU).
Added silicon issues 21 (ADC), 22 (RTCC) and 23
(JTAG), and data sheet clarification 1 (DC
Characteristics: I/O Pin Input Specifications).
Rev F Document (10/2010)
Updated the work around in silicon issue 21 (ADC).
Added silicon issue 24 (All).
Rev G Document (3/2011)
Removed data sheet clarification 1.
Updated the Affected Silicon Revisions for item 24 in
Table 2 and in silicon issue 24 (All).
Added silicon issue 25 (I/O Port).
Rev H Document (11/2011)
Updated the current Device Data Sheet revision to “F”.
Added Rev. A5 silicon information.
Added silicon issues 26 (CPU), 27 (CPU), 28 (UART),
and 29 (JTAG).
Rev J
Document (7/2013)
Updated the current Device Data Sheet revision to “G”.
Added data sheet clarifications 1 through 4 (Electrical
Characteristics) and data sheet clarifications 5 through
6 (High-Temperature Electrical Characteristics).
Other minor typographic changes have been made to
improve table readability.