Datasheet

© 2007-2012 Microchip Technology Inc. DS70293G-page 361
PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 AND PIC24HJ128GPX02/X04
33.0 PACKAGING INFORMATION
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: If the full Microchip part number cannot be marked on one line, it is carried over to the next
line, thus limiting the number of available characters for customer-specific information.
3
e
3
e
28-Lead SPDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC24HJ32GP
0730235
28-Lead SOIC (.300”)
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC24HJ32GP
0730235
302-E/SP
302-E/SO
3
e
3
e
XXXXXXXXXX
44-Lead QFN
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
PIC
Example
-E/ML
0730235
44-Lead TQFP
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
24HJ32GP304
Example
PIC
-I/PT
0730235
3
e
24HJ32GP304
3
e
XXXXXXXX
28-Lead QFN-S
XXXXXXXX
YYWWNNN
24HJ32GP
Example
302EMM
0730235