Datasheet

© 2009 Microchip Technology Inc. DS70175H-page 281
PIC24HJXXXGPX06/X08/X10
Section 19.0 “Enhanced CAN
(ECAN™) Module”
Changed bit 11 in the ECAN Control Register 1 (CiCTRL1) to Reserved
(see Register 19-1).
Added the ECAN Filter 15-8 Mask Selection (CiFMSKSEL2) register (see
Register 19-19).
Section 20.0 “10-Bit/12-Bit Analog-to-
Digital Converter (ADC)”
Replaced the ADC Module Block Diagram (see Figure 20-1) and removed
Figure 21-2.
Section 21.0 “Special Features” Added Note 2 to the Device Configuration Register Map (see Table 21-1)
Section 24.0 “Electrical
Characteristics”
Updated Typical values for Thermal Packaging Characteristics (see
Table 24-3).
Updated Min and Max values for parameter DC12 (RAM Data Retention
Voltage) and added Note 4 (see Table 24-4).
Updated Power-Down Current Max values for parameters DC60b and
DC60c (see Table 24-7).
Updated Characteristics for I/O Pin Input Specifications (see Table 24-9).
Updated Program Memory values for parameters 136, 137 and 138
(renamed to 136a, 137a and 138a), added parameters 136b, 137b and
138b, and added Note 2 (see Table 24-12).
Added parameter OS42 (G
M) to the External Clock Timing Requirements
(see Table 24-16).
Updated Watchdog Timer Time-out Period parameter SY20 (see
Table 24-21).
TABLE A-2: MAJOR SECTION UPDATES (CONTINUED)
Section Name Update Description