Datasheet
PIC24HJ12GP201/202
DS70282E-page 250 © 2007-2011 Microchip Technology Inc.
Section 22.0 “Packaging
Information”
Added 28-lead SSOP package marking information.
“Product Identification
System”
Added Plastic Shrink Small Outline (SSOP) package information.
TABLE 23-1: MAJOR SECTION UPDATES
Section Name Update Description