Datasheet

PIC24FJ128GA310 FAMILY
DS39996F-page 360  2010-2011 Microchip Technology Inc.
32.1 DC Characteristics
FIGURE 32-1: PIC24FJ128GA310 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
TABLE 32-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
PIC24FJ128GA310 family:
Operating Junction Temperature Range TJ -40 — +125 °C
Operating Ambient Temperature Range TA -40 — +85 °C
Power Dissipation:
Internal Chip Power Dissipation: P
INT = VDD x (IDD –  IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
PI/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJMAX – TA)/JA W
Frequency
Voltage (VDD)
2.0V
32 MHz
3.6V
3.6V
2.0V
2.2V
2.2V
Note: V
CAP (nominal On-Chip Regulator output voltage) = 1.8V.
PIC24FJXXXDA1
TABLE 32-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Note
Package Thermal Resistance, 14x14x1 mm 100-pin TQFP 
JA 43.0 — °C/W (Note 1)
Package Thermal Resistance, 12x12x1 mm 100-pin TQFP 
JA 45.0 — °C/W (Note 1)
Package Thermal Resistance, 12x12x1 mm 80-pin TQFP 
JA 48.0 — °C/W (Note 1)
Package Thermal Resistance, 10x10x1 mm 64-pin TQFP 
JA 48.3 — °C/W (Note 1)
Package Thermal Resistance, 9x9x0.9 mm 64-pin QFN 
JA 28.0 — °C/W (Note 1)
Package Thermal Resistance, 10x10x1.1 mm 121-pin BGA 
JA 40.2 — °C/W (Note 1)
Note 1: Junction to ambient thermal resistance, Theta-
JA (JA) numbers are achieved by package simulations.