Datasheet

 2010 Microchip Technology Inc. DS39951C-page 265
PIC24FJ64GA104 FAMILY
TABLE 28-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
PIC24FJ64GA104 Family:
Operating Junction Temperature Range TJ -40 — +140 °C
Operating Ambient Temperature Range TA -40 — +125 °C
Power Dissipation:
Internal Chip Power Dissipation:
P
INT = VDD x (IDD –  IOH)
PD PINT + PI/O W
I/O Pin Power Dissipation:
P
I/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/JA W
TABLE 28-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 300 mil SOIC 
JA 49 — °C/W (Note 1)
Package Thermal Resistance, 6x6x0.9 mm QFN 
JA 33.7 — °C/W (Note 1)
Package Thermal Resistance, 8x8x1 mm QFN 
JA 28 — °C/W (Note 1)
Package Thermal Resistance, 10x10x1 mm TQFP JA 39.3 — °C/W (Note 1)
Note 1: Junction to ambient thermal resistance; Theta-
JA (JA) numbers are achieved by package simulations.