Datasheet

PIC24FJ256GA110 FAMILY
DS39905E-page 270  2010 Microchip Technology Inc.
28.1 DC Characteristics
FIGURE 28-1: PIC24FJ256GA110 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
TABLE 28-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
PIC24FJ256GA110 Family:
Operating Junction Temperature Range TJ -40 — +140 °C
Operating Ambient Temperature Range TA -40 — +125 °C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD –  IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
P
I/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/JA W
Frequency
Voltage (VDDCORE)
(1)
3.00V
2.00V
32 MHz
2.75V
2.50V
2.25V
2.75V
16 MHz
2.25V
For frequencies between 16 MHz and 32 MHz, FMAX = (64 MHz/V) * (VDDCORE – 2V) + 16 MHz.
Note 1: When the voltage regulator is disabled, V
DD and VDDCORE must be maintained so that
V
DDCOREVDD3.6V.
PIC24FJXXXGA1XX
TABLE 28-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 14x14x1 mm TQFP 
JA 50.0 — °C/W (Note 1)
Package Thermal Resistance, 12x12x1 mm TQFP 
JA 69.4 — °C/W (Note 1)
Package Thermal Resistance, 10x10x1 mm TQFP JA 76.6 — °C/W (Note 1)
Package Thermal Resistance, 9x9x0.9 mm QFN 
JA 28.0 — °C/W (Note 1)
Note 1: Junction to ambient thermal resistance, Theta-
JA (JA) numbers are achieved by package simulations.