Datasheet

PIC24FJ256DA210 FAMILY
DS39969B-page 372  2010 Microchip Technology Inc.
30.1 DC Characteristics
FIGURE 30-1: PIC24FJ256DA210 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
TABLE 30-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
PIC24FJ256DA210 family:
Operating Junction Temperature Range TJ -40 — +125 °C
Operating Ambient Temperature Range TA -40 — +85 °C
Power Dissipation (with ENVREG = 1):
Internal Chip Power Dissipation: P
INT = VDD x (IDD –  IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
PI/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJMAX – TA)/JA W
Frequency
Voltage (VDD)
VBOR
32 MHz
3.6V
3.6V
PIC24FJXXXDA1
VBOR
2.2V
2.2V
Note: V
CAP (nominal On-Chip Regulator output voltage) = 1.8V.
TABLE 30-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Note
Package Thermal Resistance, 12x12x1 mm TQFP JA 69.4 — °C/W (Note 1)
Package Thermal Resistance, 10x10x1 mm TQFP 
JA 76.6 — °C/W (Note 1)
Package Thermal Resistance, 9x9x0.9 mm QFN 
JA 28.0 — °C/W (Note 1)
Package Thermal Resistance, 10x10x1.1 mm BGA 
JA 40.2 — °C/W (Note 1)
Note 1: Junction to ambient thermal resistance, Theta-
JA (JA) numbers are achieved by package simulations.