Datasheet

PIC24FJ16MC101/102 AND PIC24FJ32MC101/102/104
DS39997C-page 256 Preliminary © 2011-2012 Microchip Technology Inc.
26.1 DC Characteristics
TABLE 26-1: OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
PIC24FJ16MC101/102 and
PIC24FJ32MC101/102/104
DC5 V
BOR-3.6V
(1)
-40°C to +85°C 16
V
BOR-3.6V
(1)
-40°C to +125°C 16
Note 1: Overall functional device operation at V
BOR < VDD < VDDMIN is guaranteed but not characterized. All
device analog modules such as the ADC, etc., will function but with degraded performance below V
DDMIN.
TABLE 26-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
Industrial Temperature Devices
Operating Junction Temperature Range TJ -40 — +125 °C
Operating Ambient Temperature Range TA -40 — +85 °C
Extended Temperature Devices
Operating Junction Temperature Range TJ -40 — +140 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD – Σ IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
I/O = Σ ({V
DD – VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/θJA W
TABLE 26-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 28-pin SPDIP
θJA 50 — °C/W 1
Package Thermal Resistance, 20-pin SOIC θJA 63 — °C/W 1
Package Thermal Resistance, 28-pin SOIC
θJA 55 — °C/W 1
Package Thermal Resistance, 20-pin SSOP
θJA 90 — °C/W 1
Package Thermal Resistance, 28-pin SSOP
θJA 71 — °C/W 1
Package Thermal Resistance, 28-pin QFN (6x6 mm)
θJA 37 — °C/W 1
Package Thermal Resistance, 36-pin VTLA (5x5 mm)
θJA 31.1 — °C/W 1
Package Thermal Resistance, 44-pin TQFP
θJA 45 — °C/W 1,2
Package Thermal Resistance, 44-pin QFN
θJA 32 — °C/W
1,2
Package Thermal Resistance, 44-pin VTLA
θJA 30 — °C/W 1,2
Note 1: Junction to ambient thermal resistance, Theta-
JA (θJA) numbers are achieved by package simulations.
2: This package is available in PIC24FJ32MC101/102/104 devices only.