Datasheet

 2008-2011 Microchip Technology Inc. DS39927C-page 217
PIC24F16KA102 FAMILY
TABLE 29-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
Operating Junction Temperature Range T
J -40 — +175 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD –  IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
P
I/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/JA W
TABLE 29-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 20-Pin PDIP 
JA 62.4 — °C/W 1
Package Thermal Resistance, 28-Pin SPDIP 
JA 60 — °C/W 1
Package Thermal Resistance, 20-Pin SSOP 
JA 108 — °C/W 1
Package Thermal Resistance, 28-Pin SSOP JA 71 — °C/W 1
Package Thermal Resistance, 20-Pin SOIC JA 75 — °C/W 1
Package Thermal Resistance, 28-Pin SOIC 
JA 80.2 — °C/W 1
Package Thermal Resistance, 20-Pin QFN JA 43 — °C/W 1
Package Thermal Resistance, 28-Pin QFN JA 32 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (JA) numbers are achieved by package simulations.