Datasheet

 2011-2013 Microchip Technology Inc. DS30001037C-page 201
PIC24F16KL402 FAMILY
TABLE 26-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
Operating Junction Temperature Range T
J -40 — +140 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal Chip Power Dissipation:
P
INT = VDD x (IDD –  IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
P
I/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/JA W
TABLE 26-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 20-Pin PDIP 
JA 62.4 — °C/W 1
Package Thermal Resistance, 28-Pin SPDIP JA 60 — °C/W 1
Package Thermal Resistance, 20-Pin SSOP 
JA 108 — °C/W 1
Package Thermal Resistance, 28-Pin SSOP JA 71 — °C/W 1
Package Thermal Resistance, 20-Pin SOIC JA 75 — °C/W 1
Package Thermal Resistance, 28-Pin SOIC 
JA 80.2 — °C/W 1
Package Thermal Resistance, 20-Pin QFN JA 43 — °C/W 1
Package Thermal Resistance, 28-Pin QFN JA 32 — °C/W 1
Package Thermal Resistance, 14-Pin PDIP 
JA 62.4 — °C/W 1
Package Thermal Resistance, 14-Pin TSSOP JA 108 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
TABLE 26-3: DC CHARACTERISTICS: TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 1.8V to 3.6V
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  T
A  +125°C for Extended
Para
m No.
Symbol Characteristic Min Typ
(1)
Max Units Conditions
DC10 V
DD Supply Voltage 1.8 — 3.6 V
DC12 V
DR RAM Data Retention
Voltage
(2)
1.5 — — V
DC16 V
POR VDD Start Voltage
to Ensure Internal
Power-on Reset Signal
VSS —0.7V
DC17 SVDD VDD Rise Rate
to Ensure Internal
Power-on Reset Signal
0.05 — — V/ms 0-3.3V in 0.1s
0-2.5V in 60 ms
VBG Band Gap Voltage
Reference
1.14 1.2 1.26 V
Note 1: Data in “Typ” column is at 3.3V, +25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: This is the limit to which VDD can be lowered without losing RAM data.