Datasheet
Table Of Contents
- Analog Features:
- LCD Driver and Keypad Interface Features:
- Flexible Oscillator Structure:
- Low-Power Features:
- Peripheral Highlights:
- Special Microcontroller Features:
- Target Applications:
- Pin Diagram
- Typical Application Circuit: Single-Phase Power Meter
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 Guidelines for Getting Started with PIC18FJ Microcontrollers
- 3.0 Oscillator Configurations
- 3.1 Oscillator Types
- 3.2 Control Registers
- 3.3 Clock Sources and Oscillator Switching
- 3.4 External Oscillator Modes
- 3.5 Internal Oscillator Block
- 3.6 Effects of Power-Managed Modes on the Various Clock Sources
- 3.7 Power-up Delays
- 4.0 Power-Managed Modes
- 5.0 Reset
- 6.0 Memory Organization
- 6.1 Program Memory Organization
- 6.2 PIC18 Instruction Cycle
- 6.3 Data Memory Organization
- 6.4 Data Addressing Modes
- 6.5 Program Memory and the Extended Instruction Set
- 6.6 Data Memory and the Extended Instruction Set
- 7.0 Flash Program Memory
- 7.1 Table Reads and Table Writes
- 7.2 Control Registers
- 7.3 Reading the Flash Program Memory
- 7.4 Erasing Flash Program Memory
- 7.5 Writing to Flash Program Memory
- 7.6 Flash Program Operation During Code Protection
- 8.0 8 X 8 Hardware Multiplier
- 8.1 Introduction
- 8.2 Operation
- EXAMPLE 8-1: 8 x 8 Unsigned Multiply Routine
- EXAMPLE 8-2: 8 x 8 Signed Multiply Routine
- TABLE 8-1: Performance Comparison for Various Multiply Operations
- EQUATION 8-1: 16 x 16 Unsigned Multiplication Algorithm
- EXAMPLE 8-3: 16 x 16 Unsigned Multiply Routine
- EQUATION 8-2: 16 x 16 Signed Multiplication Algorithm
- EXAMPLE 8-4: 16 x 16 Signed Multiply Routine
- 9.0 Interrupts
- 10.0 I/O Ports
- FIGURE 10-1: Generic I/O Port Operation
- 10.1 I/O Port Pin Capabilities
- 10.2 PORTA, TRISA and LATA Registers
- 10.3 PORTB, TRISB and LATB Registers
- 10.4 PORTC, TRISC and LATC Registers
- 10.5 PORTD, TRISD and LATD Registers
- 10.6 PORTE, TRISE and LATE Registers
- 10.7 PORTF, LATF and TRISF Registers
- 10.8 PORTG, TRISG and LATG Registers
- 11.0 Timer0 Module
- 12.0 Timer1 Module
- 13.0 Timer2 Module
- 14.0 Timer3 Module
- 15.0 Real-Time Clock and Calendar (RTCC)
- FIGURE 15-1: RTCC Block Diagram
- 15.1 RTCC Module Registers
- RTCC Control Registers
- RTCC Value Registers
- Alarm Value Registers
- 15.1.1 RTCC Control Registers
- 15.1.2 RTCVALH and RTCVALL Register Mappings
- Register 15-6: Reserved Register
- Register 15-7: Year: Year Value Register(1)
- Register 15-8: MontH: Month Value Register(1)
- Register 15-9: Day: Day Value Register(1)
- Register 15-10: Weekday: Weekday Value Register(1)
- Register 15-11: Hour: Hour Value Register(1)
- Register 15-12: MINUTE: Minute Value Register
- Register 15-13: SECOND: Second Value Register
- 15.1.3 ALRMVALH and ALRMVALL Register Mappings
- Register 15-14: ALRMMNTH: Alarm Month Value Register(1)
- Register 15-15: ALRMDAY: Alarm Day Value Register(1)
- Register 15-16: ALRMWd: Alarm Weekday Value Register(1)
- Register 15-17: ALRMHr: Alarm Hours Value Register(1)
- Register 15-18: ALRMMIN: Alarm Minutes Value Register
- Register 15-19: ALRMSEC: Alarm Seconds Value Register
- 15.1.4 RTCEN Bit Write
- 15.2 Operation
- 15.3 Alarm
- 15.4 Sleep Mode
- 15.5 Reset
- 15.6 Register Maps
- 16.0 Capture/Compare/PWM (CCP) Modules
- 17.0 Liquid Crystal Display (LCD) Driver Module
- FIGURE 17-1: LCD Driver Module Block Diagram
- 17.1 LCD Registers
- 17.2 LCD Clock Source
- 17.3 LCD Bias Generation
- 17.4 LCD Multiplex Types
- 17.5 Segment Enables
- 17.6 Pixel Control
- 17.7 LCD Frame Frequency
- 17.8 LCD Waveform Generation
- FIGURE 17-6: Type-A/Type-B Waveforms in Static Drive
- FIGURE 17-7: Type-A Waveforms in 1/2 MUX, 1/2 Bias Drive
- FIGURE 17-8: Type-B Waveforms in 1/2 MUX, 1/2 Bias Drive
- FIGURE 17-9: Type-A Waveforms in 1/2 MUX, 1/3 Bias Drive
- FIGURE 17-10: Type-B Waveforms in 1/2 MUX, 1/3 Bias Drive
- FIGURE 17-11: Type-A Waveforms in 1/3 MUX, 1/2 Bias Drive
- FIGURE 17-12: Type-B Waveforms in 1/3 MUX, 1/2 Bias Drive
- FIGURE 17-13: Type-A Waveforms in 1/3 MUX, 1/3 Bias Drive
- FIGURE 17-14: Type-B Waveforms in 1/3 MUX, 1/3 Bias Drive
- FIGURE 17-15: Type-A Waveforms in 1/4 MUX, 1/3 Bias Drive
- FIGURE 17-16: Type-B Waveforms in 1/4 MUX, 1/3 Bias Drive
- 17.9 LCD Interrupts
- 17.10 Operation During Sleep
- 17.11 Configuring the LCD Module
- 18.0 Master Synchronous Serial Port (MSSP) Module
- 18.1 Master SSP (MSSP) Module Overview
- 18.2 Control Registers
- 18.3 SPI Mode
- FIGURE 18-1: MSSP Block Diagram (SPI Mode)
- 18.3.1 Registers
- 18.3.2 Operation
- 18.3.3 Enabling SPI I/O
- 18.3.4 Open-Drain Output Option
- 18.3.5 Typical Connection
- 18.3.6 Master Mode
- 18.3.7 Slave Mode
- 18.3.8 Slave Select Synchronization
- 18.3.9 Operation in Power-Managed Modes
- 18.3.10 Effects of a Reset
- 18.3.11 Bus Mode Compatibility
- 18.4 I2C Mode
- FIGURE 18-7: MSSP Block Diagram (I2C™ Mode)
- 18.4.1 Registers
- 18.4.2 Operation
- 18.4.3 Slave Mode
- EXAMPLE 18-2: Address Masking Examples
- FIGURE 18-8: I2C™ Slave Mode Timing with SEN = 0 (Reception, 7-bit Addressing)
- FIGURE 18-9: I2C™ Slave Mode Timing with SEN = 0 and ADMSK<5:1> = 01011 (Reception, 7-bit Addressing)
- FIGURE 18-10: I2C™ Slave Mode Timing (Transmission, 7-bit Addressing)
- FIGURE 18-11: I2C™ Slave Mode Timing with SEN = 0 (Reception, 10-bit Addressing)
- FIGURE 18-12: I2C™ Slave Mode Timing with SEN = 0 and ADMSK<5:1> = 01001 (Reception, 10-bit Addressing)
- FIGURE 18-13: I2C™ Slave Mode Timing (Transmission, 10-bit Addressing)
- 18.4.4 Clock Stretching
- 18.4.5 General Call Address Support
- 18.4.6 Master Mode
- 18.4.7 Baud Rate
- 18.4.8 I2C Master Mode Start Condition Timing
- 18.4.9 I2C Master Mode Repeated Start Condition Timing
- 18.4.10 I2C Master Mode Transmission
- 18.4.11 I2C Master Mode Reception
- 18.4.12 Acknowledge Sequence Timing
- 18.4.13 Stop Condition Timing
- 18.4.14 Sleep Operation
- 18.4.15 Effects of a Reset
- 18.4.16 Multi-Master Mode
- 18.4.17 Multi -Master Communication, Bus Collision and Bus Arbitration
- FIGURE 18-27: Bus Collision Timing for Transmit and Acknowledge
- FIGURE 18-28: Bus Collision During Start Condition (SDA Only)
- FIGURE 18-29: Bus Collision During Start Condition (SCL = 0)
- FIGURE 18-30: BRG Reset Due to SDA Arbitration During Start Condition
- FIGURE 18-31: Bus Collision During a Repeated Start Condition (Case 1)
- FIGURE 18-32: Bus Collision During Repeated Start Condition (Case 2)
- FIGURE 18-33: Bus Collision During a Stop Condition (Case 1)
- FIGURE 18-34: Bus Collision During a Stop Condition (Case 2)
- TABLE 18-4: Registers Associated with I2C™ Operation
- 19.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART)
- 19.1 Control Registers
- 19.2 EUSART Baud Rate Generator (BRG)
- 19.3 EUSART Asynchronous Mode
- 19.4 EUSART Synchronous Master Mode
- 19.5 EUSART Synchronous Slave Mode
- 20.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART)
- 20.1 Control Registers
- 20.2 AUSART Baud Rate Generator (BRG)
- 20.3 AUSART Asynchronous Mode
- 20.4 AUSART Synchronous Master Mode
- 20.5 AUSART Synchronous Slave Mode
- 21.0 12-Bit Analog-to-Digital Converter (A/D) Module
- Register 21-1: ADCON0: A/D Control Register 0
- Register 21-2: ADCON1: A/D Control Register 1
- Register 21-3: ADCON2: A/D Control Register 2
- FIGURE 21-1: A/D Block Diagram(1,2)
- FIGURE 21-2: Analog Input Model
- 21.1 A/D Acquisition Requirements
- 21.2 Selecting and Configuring Automatic Acquisition Time
- 21.3 Selecting the A/D Conversion Clock
- 21.4 Configuring Analog Port Pins
- 21.5 A/D Conversions
- 21.6 Use of the CCP2 Trigger
- 21.7 A/D Converter Calibration
- 21.8 Operation in Power-Managed Modes
- 22.0 Dual-Channel, 24-Bit Analog Front End (AFE)
- 23.0 Comparator Module
- Register 23-1: CMCON: Comparator Module Control Register
- 23.1 Comparator Configuration
- 23.2 Comparator Operation
- 23.3 Comparator Reference
- 23.4 Comparator Response Time
- 23.5 Comparator Outputs
- 23.6 Comparator Interrupts
- 23.7 Comparator Operation During Sleep
- 23.8 Effects of a Reset
- 23.9 Analog Input Connection Considerations
- 24.0 Comparator Voltage Reference Module
- 25.0 Charge Time Measurement Unit (CTMU)
- FIGURE 25-1: CTMU Block Diagram
- 25.1 CTMU Operation
- 25.2 CTMU Module Initialization
- 25.3 Calibrating the CTMU Module
- 25.4 Measuring Capacitance with the CTMU
- 25.5 Measuring Time with the CTMU Module
- 25.6 Creating a Delay with the CTMU Module
- 25.7 Operation During Sleep/Idle Modes
- 25.8 Effects of a Reset on CTMU
- 25.9 Registers
- 26.0 Special Features of the CPU
- 26.1 Configuration Bits
- 26.1.1 Considerations for Configuring PIC18F87J72 Family Devices
- TABLE 26-1: Mapping of the Flash Configuration Words to the Configuration Registers
- TABLE 26-2: Configuration Bits and Device IDs
- Register 26-1: CONFIG1L: Configuration Register 1 Low (Byte Address 300000h)
- Register 26-2: CONFIG1H: Configuration Register 1 High (Byte Address 300001h)
- Register 26-3: CONFIG2L: Configuration Register 2 Low (Byte Address 300002h)
- Register 26-4: CONFIG2H: Configuration Register 2 High (Byte Address 300003h)
- Register 26-5: CONFIG3L: Configuration Register 3 Low (Byte Address 300004h)
- Register 26-6: CONFIG3H: Configuration Register 3 High (Byte Address 300005h)
- Register 26-7: DEVID1: Device ID Register 1
- Register 26-8: DEVID2: Device ID Register 2
- 26.1.1 Considerations for Configuring PIC18F87J72 Family Devices
- 26.2 Watchdog Timer (WDT)
- 26.3 On-Chip Voltage Regulator
- 26.4 Two-Speed Start-up
- 26.5 Fail-Safe Clock Monitor
- 26.6 Program Verification and Code Protection
- 26.7 In-Circuit Serial Programming
- 26.8 In-Circuit Debugger
- 26.1 Configuration Bits
- 27.0 Instruction Set Summary
- 27.1 Standard Instruction Set
- 27.2 Extended Instruction Set
- 28.0 Development Support
- 28.1 MPLAB Integrated Development Environment Software
- 28.2 MPLAB C Compilers for Various Device Families
- 28.3 HI-TECH C for Various Device Families
- 28.4 MPASM Assembler
- 28.5 MPLINK Object Linker/ MPLIB Object Librarian
- 28.6 MPLAB Assembler, Linker and Librarian for Various Device Families
- 28.7 MPLAB SIM Software Simulator
- 28.8 MPLAB REAL ICE In-Circuit Emulator System
- 28.9 MPLAB ICD 3 In-Circuit Debugger System
- 28.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express
- 28.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express
- 28.12 MPLAB PM3 Device Programmer
- 28.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits
- 29.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 29.1 DC Characteristics: Supply Voltage PIC18F87J72 Family (Industrial)
- 29.2 DC Characteristics: Power-Down and Supply Current PIC18F87J72 Family (Industrial)
- 29.3 DC Characteristics: PIC18F87J72 Family (Industrial)
- 29.4 DC Characteristics: CTMU Current Source Specifications
- 29.5 AC (Timing) Characteristics
- 29.5.1 Timing Parameter Symbology
- 29.5.2 Timing Conditions
- 29.5.3 Timing Diagrams and Specifications
- FIGURE 29-4: External Clock Timing
- TABLE 29-7: External Clock Timing Requirements
- TABLE 29-8: PLL Clock Timing Specifications (Vdd = 2.15V to 3.6V)
- TABLE 29-9: Internal RC Accuracy (INTOSC and INTRC Sources)
- FIGURE 29-5: CLKO and I/O Timing
- TABLE 29-10: CLKO and I/O Timing Requirements
- FIGURE 29-6: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing
- TABLE 29-11: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements
- FIGURE 29-7: Timer0 and Timer1 External Clock Timings
- TABLE 29-12: Timer0 and Timer1 External Clock Requirements
- FIGURE 29-8: Capture/Compare/PWM Timings (CCP1, CCP2 Modules)
- TABLE 29-13: Capture/Compare/PWM Requirements (CCP1, CCP2 Modules)
- FIGURE 29-9: Example SPI Master Mode Timing (CKE = 0)
- TABLE 29-14: Example SPI Mode Requirements (Master Mode, Cke = 0)
- FIGURE 29-10: Example SPI Master Mode Timing (CKE = 1)
- TABLE 29-15: Example SPI Mode Requirements (Master Mode, CKE = 1)
- FIGURE 29-11: Example SPI Slave Mode Timing (CKE = 0)
- TABLE 29-16: Example SPI Mode Requirements (Slave Mode Timing, CKE = 0)
- FIGURE 29-12: Example SPI Slave Mode Timing (CKE = 1)
- TABLE 29-17: Example SPI Slave Mode Requirements (CKE = 1)
- FIGURE 29-13: I2C™ Bus Start/Stop Bits Timing
- TABLE 29-18: I2C™ Bus Start/Stop Bits Requirements (Slave Mode)
- FIGURE 29-14: I2C™ Bus Data Timing
- TABLE 29-19: I2C™ Bus Data Requirements (Slave Mode)
- FIGURE 29-15: MSSP I2C™ Bus Start/Stop Bits Timing Waveforms
- TABLE 29-20: MSSP I2C™ Bus Start/Stop Bits Requirements
- FIGURE 29-16: MSSP I2C™ Bus Data Timing
- TABLE 29-21: MSSP I2C™ Bus Data Requirements
- FIGURE 29-17: EUSART/AUSART Synchronous Transmission (Master/Slave) Timing
- TABLE 29-22: EUSART/AUSART Synchronous Transmission Requirements
- FIGURE 29-18: EUSART/AUSART Synchronous Receive (Master/Slave) Timing
- TABLE 29-23: EUSART/AUSART Synchronous Receive Requirements
- TABLE 29-24: A/D Converter Characteristics: PIC18F87J72 Family (Industrial)
- FIGURE 29-19: A/D Conversion Timing
- TABLE 29-25: A/D Conversion Requirements
- TABLE 29-26: Dual-Channel AFE Electrical Characteristics
- TABLE 29-27: Dual-Channel AFE Serial Peripheral Interface Specifications
- FIGURE 29-20: Serial Output Timing Diagram
- FIGURE 29-21: Serial Input Timing Diagram
- FIGURE 29-22: Data Ready Pulse Timing Diagram
- FIGURE 29-23: Specific Timing Diagrams
- 30.0 Packaging Information
- Appendix A: Revision History
- Appendix B: Dual-Channel, 24-Bit AFE Reference
- TABLE B-1: OVERSAMPLING RATIO SETTINGS
- TABLE B-2: Device data rates in function of mclk, osr AND PRESCALE
- TABLE B-3: OVERSAMPLING RATIO SETTINGS
- Step 1
- Step 2
- TABLE B-4: PGA Configuration Setting
- TABLE B-5: adc RESOLUTION vs. osr
- TABLE B-6: OSR = 256 output code examples
- TABLE B-7: OSR = 128 output code examples
- TABLE B-8: OSR = 64 output code examples
- TABLE B-9: OSR = 32 output code examples
- TABLE B-10: Phase Values With MCLK = 4 MHz, OSR = 256
- TABLE B-11: Register Groups
- TABLE B-12: Register Types
- TABLE B-13: Register map
- TABLE B-14: Register Map Grouping for Continuous read modes
- TABLE B-15: Phase Encoding Resolution By Oversampling Ratio
- INDEX
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PIC18F87J72 FAMILY
DS39979A-page 22 2010 Microchip Technology Inc.
2.2 Power Supply Pins
2.2.1 DECOUPLING CAPACITORS
The use of decoupling capacitors on every pair of
power supply pins, such as V
DD, VSS, AVDD and
AV
SS, is required.
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: A 0.1 F (100 nF),
10-20V capacitor is recommended. The capacitor
should be a low-ESR device, with a resonance
frequency in the range of 200 MHz and higher.
Ceramic capacitors are recommended.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is no greater
than 0.25 inch (6 mm).
• Handling high-frequency noise: If the board is
experiencing high-frequency noise (upward of
tens of MHz), add a second ceramic type capaci-
tor in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 F to 0.001 F. Place this
second capacitor next to each primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible
(e.g., 0.1 F in parallel with 0.001 F).
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB trace
inductance.
2.2.2 TANK CAPACITORS
On boards with power traces running longer than
six inches in length, it is suggested to use a tank capac-
itor for integrated circuits, including microcontrollers, to
supply a local power source. The value of the tank
capacitor should be determined based on the trace
resistance that connects the power supply source to
the device, and the maximum current drawn by the
device in the application. In other words, select the tank
capacitor so that it meets the acceptable voltage sag at
the device. Typical values range from 4.7 F to 47 F.
2.3 Master Clear (MCLR) Pin
The MCLR pin provides two specific device
functions: Device Reset, and Device Programming
and Debugging. If programming and debugging are
not required in the end application, a direct
connection to V
DD may be all that is required. The
addition of other components, to help increase the
application’s resistance to spurious Resets from
voltage sags, may be beneficial. A typical
configuration is shown in Figure 2-1. Other circuit
designs may be implemented, depending on the
application’s requirements.
During programming and debugging, the resistance
and capacitance that can be added to the pin must
be considered. Device programmers and debuggers
drive the MCLR
pin. Consequently, specific voltage
levels (V
IH and VIL) and fast signal transitions must
not be adversely affected. Therefore, specific values
of R1 and C1 will need to be adjusted based on the
application and PCB requirements. For example, it is
recommended that the capacitor, C1, be isolated
from the MCLR
pin during programming and
debugging operations by using a jumper (Figure 2-2).
The jumper is replaced for normal run-time
operations.
Any components associated with the MCLR
pin
should be placed within 0.25 inch (6 mm) of the pin.
FIGURE 2-2: EXAMPLE OF MCLR PIN
CONNECTIONS
Note 1: R1 10 k is recommended. A suggested
starting value is 10 k. Ensure that the
MCLR
pin VIH and VIL specifications are met.
2: R2 470 will limit any current flowing into
MCLR
from the external capacitor, C, in the
event of MCLR
pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR
pin
V
IH and VIL specifications are met.
C1
R2
R1
V
DD
MCLR
PIC18FXXJXX
JP