Datasheet

 2003-2013 Microchip Technology Inc. DS39612C-page 377
PIC18F6525/6621/8525/8621
29.2 Package Details
The following sections give the technical details of the
packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
1510515105
β
Mold Draft Angle Bottom
1510515105
α
Mold Draft Angle Top
0.270.220.17.011.009.007BLead Width
0.230.180.13.009.007.005
c
Lead Thickness
1616n1Pins per Side
10.1010.009.90.398.394.390D1Molded Package Length
10.1010.009.90.398.394.390E1Molded Package Width
12.2512.0011.75.482.472.463DOverall Length
12.2512.0011.75.482.472.463EOverall Width
73.5073.50
φ
Foot Angle
0.750.600.45.030.024.018LFoot Length
0.250.150.05.010.006.002A1Standoff
1.051.000.95.041.039.037A2Molded Package Thickness
1.20
1.101.00.047.043.039AOverall Height
0.50.020
p
Pitch
6464
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERS*INCHESUnits
c
2
1
n
D
D1
B
p
#leads=n1
E1
E
A2
A1
A
L
CH x 45°
β
φ
α
(F)
Footprint (Reference)
(F)
.039 1.00
Pin 1 Corner Chamfer CH .025 .035 .045 0.64 0.89 1.14
shall not exceed .010" (0.254mm) per side.
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
Notes:
JEDEC Equivalent: MS-026
Drawing No. C04-085
*Controlling Parameter
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging