Datasheet
Table Of Contents
- Low-Power Features:
- LCD Driver Module Features:
- Special Microcontroller Features:
- Flexible Oscillator Structure:
- Peripheral Highlights:
- Pin Diagrams
- Pin Diagrams (Continued)
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 1.1 Core Features
- 1.2 LCD Driver
- 1.3 Other Special Features
- 1.4 Details on Individual Family Members
- TABLE 1-1: Device Features for the PIC18F85J90 family (64-pin Devices)
- TABLE 1-2: Device Features for the PIC18F85J90 family (80-pin Devices)
- FIGURE 1-1: PIC18F6XJ90 (64-pin) Block Diagram
- FIGURE 1-2: PIC18F8XJ90 (80-pin) Block Diagram
- TABLE 1-3: PIC18F6XJ90 Pinout I/O Descriptions
- TABLE 1-4: PIC18F8XJ90 Pinout I/O Descriptions
- 2.0 Guidelines for Getting Started with PIC18FJ Microcontrollers
- 3.0 Oscillator Configurations
- 3.1 Oscillator Types
- 3.2 Control Registers
- 3.3 Clock Sources and Oscillator Switching
- 3.4 External Oscillator Modes
- 3.5 Internal Oscillator Block
- 3.6 Effects of Power-Managed Modes on the Various Clock Sources
- 3.7 Power-up Delays
- 4.0 Power-Managed Modes
- 5.0 Reset
- 6.0 Memory Organization
- 6.1 Program Memory Organization
- 6.2 PIC18 Instruction Cycle
- 6.3 Data Memory Organization
- 6.4 Data Addressing Modes
- 6.5 Program Memory and the Extended Instruction Set
- 6.6 Data Memory and the Extended Instruction Set
- 7.0 Flash Program Memory
- 7.1 Table Reads and Table Writes
- 7.2 Control Registers
- 7.3 Reading the Flash Program Memory
- 7.4 Erasing Flash Program Memory
- 7.5 Writing to Flash Program Memory
- 7.6 Flash Program Operation During Code Protection
- 8.0 8 X 8 Hardware Multiplier
- 8.1 Introduction
- 8.2 Operation
- EXAMPLE 8-1: 8 x 8 Unsigned Multiply Routine
- EXAMPLE 8-2: 8 x 8 Signed Multiply Routine
- TABLE 8-1: Performance Comparison for Various Multiply Operations
- EQUATION 8-1: 16 x 16 Unsigned Multiplication Algorithm
- EXAMPLE 8-3: 16 x 16 Unsigned Multiply Routine
- EQUATION 8-2: 16 x 16 Signed Multiplication Algorithm
- EXAMPLE 8-4: 16 x 16 Signed Multiply Routine
- 9.0 Interrupts
- 10.0 I/O Ports
- FIGURE 10-1: Generic I/O Port Operation
- 10.1 I/O Port Pin Capabilities
- 10.2 PORTA, TRISA and LATA Registers
- 10.3 PORTB, TRISB and LATB Registers
- 10.4 PORTC, TRISC and LATC Registers
- 10.5 PORTD, TRISD and LATD Registers
- 10.6 PORTE, TRISE and LATE Registers
- 10.7 PORTF, LATF and TRISF Registers
- 10.8 PORTG, TRISG and LATG Registers
- 10.9 PORTH, LATH and TRISH Registers
- 10.10 PORTJ, TRISJ and LATJ Registers
- 11.0 Timer0 Module
- 12.0 Timer1 Module
- 13.0 Timer2 Module
- 14.0 Timer3 Module
- 15.0 Capture/Compare/PWM (CCP) Modules
- 16.0 Liquid Crystal Display (LCD) Driver Module
- FIGURE 16-1: LCD Driver Module Block Diagram
- 16.1 LCD Registers
- 16.2 LCD Clock Source
- 16.3 LCD Bias Generation
- 16.4 LCD Multiplex Types
- 16.5 Segment Enables
- 16.6 Pixel Control
- 16.7 LCD Frame Frequency
- 16.8 LCD Waveform Generation
- FIGURE 16-6: Type-A/Type-B Waveforms in Static Drive
- FIGURE 16-7: Type-A Waveforms in 1/2 MUX, 1/2 Bias Drive
- FIGURE 16-8: Type-B Waveforms in 1/2 MUX, 1/2 Bias Drive
- FIGURE 16-9: Type-A Waveforms in 1/2 MUX, 1/3 Bias Drive
- FIGURE 16-10: Type-B Waveforms in 1/2 MUX, 1/3 Bias Drive
- FIGURE 16-11: Type-A Waveforms in 1/3 MUX, 1/2 Bias Drive
- FIGURE 16-12: Type-B Waveforms in 1/3 MUX, 1/2 Bias Drive
- FIGURE 16-13: Type-A Waveforms in 1/3 MUX, 1/3 Bias Drive
- FIGURE 16-14: Type-B Waveforms in 1/3 MUX, 1/3 Bias Drive
- FIGURE 16-15: Type-A Waveforms in 1/4 MUX, 1/3 Bias Drive
- FIGURE 16-16: Type-B Waveforms in 1/4 MUX, 1/3 Bias Drive
- 16.9 LCD Interrupts
- 16.10 Operation During Sleep
- 16.11 Configuring the LCD Module
- 17.0 Master Synchronous Serial Port (MSSP) Module
- 17.1 Master SSP (MSSP) Module Overview
- 17.2 Control Registers
- 17.3 SPI Mode
- FIGURE 17-1: MSSP Block Diagram (SPI Mode)
- 17.3.1 Registers
- 17.3.2 Operation
- 17.3.3 Enabling SPI I/O
- 17.3.4 Open-Drain Output Option
- 17.3.5 Typical Connection
- 17.3.6 Master Mode
- 17.3.7 Slave Mode
- 17.3.8 Slave Select Synchronization
- 17.3.9 Operation in Power-Managed Modes
- 17.3.10 Effects of a Reset
- 17.3.11 Bus Mode Compatibility
- 17.4 I2C Mode
- FIGURE 17-7: MSSP Block Diagram (I2C™ Mode)
- 17.4.1 Registers
- 17.4.2 Operation
- 17.4.3 Slave Mode
- EXAMPLE 17-2: Address Masking Examples
- FIGURE 17-8: I2C™ Slave Mode Timing with SEN = 0 (Reception, 7-bit Address)
- FIGURE 17-9: I2C™ Slave Mode Timing with SEN = 0 and ADMSK<5:1> = 01011 (Reception, 7-bit Address)
- FIGURE 17-10: I2C™ Slave Mode Timing (Transmission, 7-bit Address)
- FIGURE 17-11: I2C™ Slave Mode Timing with SEN = 0 (Reception, 10-bit Address)
- FIGURE 17-12: I2C™ Slave Mode Timing with SEN = 0 and ADMSK<5:1> = 01001 (Reception, 10-bit Address)
- FIGURE 17-13: I2C™ Slave Mode Timing (Transmission, 10-bit Address)
- 17.4.4 Clock Stretching
- 17.4.5 General Call Address Support
- 17.4.6 Master Mode
- 17.4.7 Baud Rate
- 17.4.8 I2C Master Mode Start Condition Timing
- 17.4.9 I2C Master Mode Repeated Start Condition Timing
- 17.4.10 I2C Master Mode Transmission
- 17.4.11 I2C Master Mode Reception
- 17.4.12 Acknowledge Sequence Timing
- 17.4.13 Stop Condition Timing
- 17.4.14 Sleep Operation
- 17.4.15 Effects of a Reset
- 17.4.16 Multi-Master Mode
- 17.4.17 Multi -Master Communication, Bus Collision and Bus Arbitration
- FIGURE 17-27: Bus Collision Timing for Transmit and Acknowledge
- FIGURE 17-28: Bus Collision During Start Condition (SDA Only)
- FIGURE 17-29: Bus Collision During Start Condition (SCL = 0)
- FIGURE 17-30: BRG Reset Due to SDA Arbitration During Start Condition
- FIGURE 17-31: Bus Collision During a Repeated Start Condition (Case 1)
- FIGURE 17-32: Bus Collision During Repeated Start Condition (Case 2)
- FIGURE 17-33: Bus Collision During a Stop Condition (Case 1)
- FIGURE 17-34: Bus Collision During a Stop Condition (Case 2)
- TABLE 17-4: Registers Associated with I2C™ Operation
- 18.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART)
- 18.1 Control Registers
- 18.2 EUSART Baud Rate Generator (BRG)
- 18.3 EUSART Asynchronous Mode
- 18.4 EUSART Synchronous Master Mode
- 18.5 EUSART Synchronous Slave Mode
- 19.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART)
- 19.1 Control Registers
- 19.2 AUSART Baud Rate Generator (BRG)
- 19.3 AUSART Asynchronous Mode
- 19.4 AUSART Synchronous Master Mode
- 19.5 AUSART Synchronous Slave Mode
- 20.0 10-bit Analog-to-Digital Converter (A/D) Module
- Register 20-1: ADCON0: A/D Control Register 0
- Register 20-2: ADCON1: A/D Control Register 1
- Register 20-3: ADCON2: A/D Control Register 2
- FIGURE 20-1: A/D Block Diagram(1,2)
- FIGURE 20-2: Analog Input Model
- 20.1 A/D Acquisition Requirements
- 20.2 Selecting and Configuring Automatic Acquisition Time
- 20.3 Selecting the A/D Conversion Clock
- 20.4 Configuring Analog Port Pins
- 20.5 A/D Conversions
- 20.6 Use of the CCP2 Trigger
- 20.7 A/D Converter Calibration
- 20.8 Operation in Power-Managed Modes
- 21.0 Comparator Module
- Register 21-1: CMCON: Comparator Module Control Register
- 21.1 Comparator Configuration
- 21.2 Comparator Operation
- 21.3 Comparator Reference
- 21.4 Comparator Response Time
- 21.5 Comparator Outputs
- 21.6 Comparator Interrupts
- 21.7 Comparator Operation During Sleep
- 21.8 Effects of a Reset
- 21.9 Analog Input Connection Considerations
- 22.0 Comparator Voltage Reference Module
- 23.0 Special Features of the CPU
- 23.1 Configuration Bits
- 23.1.1 Considerations for Configuring the PIC18F85J90 family Devices
- TABLE 23-1: Mapping of the Flash Configuration Words to the Configuration Registers
- TABLE 23-2: Configuration Bits and Device IDs
- Register 23-1: CONFIG1L: Configuration Register 1 Low (Byte Address 300000h)
- Register 23-2: CONFIG1H: Configuration Register 1 High (Byte Address 300001h)
- Register 23-3: CONFIG2L: Configuration Register 2 Low (Byte Address 300002h)
- Register 23-4: CONFIG2H: Configuration Register 2 High (Byte Address 300003h)
- Register 23-5: CONFIG3H: Configuration Register 3 High (Byte Address 300005h)
- Register 23-6: DEVID1: Device ID Register 1 for PIC18F85J90 family Devices
- Register 23-7: DEVID2: Device ID Register 2 for PIC18F85J90 family Devices
- 23.1.1 Considerations for Configuring the PIC18F85J90 family Devices
- 23.2 Watchdog Timer (WDT)
- 23.3 On-Chip Voltage Regulator
- 23.4 Two-Speed Start-up
- 23.5 Fail-Safe Clock Monitor
- 23.6 Program Verification and Code Protection
- 23.7 In-Circuit Serial Programming
- 23.8 In-Circuit Debugger
- 23.1 Configuration Bits
- 24.0 Instruction Set Summary
- 24.1 Standard Instruction Set
- 24.2 Extended Instruction Set
- 25.0 Development Support
- 25.1 MPLAB Integrated Development Environment Software
- 25.2 MPLAB C Compilers for Various Device Families
- 25.3 HI-TECH C for Various Device Families
- 25.4 MPASM Assembler
- 25.5 MPLINK Object Linker/ MPLIB Object Librarian
- 25.6 MPLAB Assembler, Linker and Librarian for Various Device Families
- 25.7 MPLAB SIM Software Simulator
- 25.8 MPLAB REAL ICE In-Circuit Emulator System
- 25.9 MPLAB ICD 3 In-Circuit Debugger System
- 25.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express
- 25.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express
- 25.12 MPLAB PM3 Device Programmer
- 25.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits
- 26.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 26.1 DC Characteristics: Supply Voltage PIC18F85J90 Family (Industrial)
- 26.2 DC Characteristics: Power-Down and Supply Current PIC18F85J90 Family (Industrial)
- 26.3 DC Characteristics: PIC18F84J90 Family (Industrial)
- 26.4 AC (Timing) Characteristics
- 26.4.1 Timing Parameter Symbology
- 26.4.2 Timing Conditions
- 26.4.3 Timing Diagrams and Specifications
- FIGURE 26-4: External Clock Timing
- TABLE 26-7: External Clock Timing Requirements
- TABLE 26-8: PLL Clock Timing Specifications (Vdd = 2.15V to 3.6V)
- TABLE 26-9: Internal RC Accuracy (INTOSC and INTRC Sources)
- FIGURE 26-5: CLKO and I/O Timing
- TABLE 26-10: CLKO and I/O Timing Requirements
- FIGURE 26-6: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing
- TABLE 26-11: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements
- FIGURE 26-7: Timer0 and Timer1 External Clock Timings
- TABLE 26-12: Timer0 and Timer1 External Clock Requirements
- FIGURE 26-8: Capture/Compare/PWM Timings (CCP1, CCP2 Modules)
- TABLE 26-13: Capture/Compare/PWM Requirements (CCP1, CCP2 Modules)
- FIGURE 26-9: Example SPI Master Mode Timing (CKE = 0)
- TABLE 26-14: Example SPI Mode Requirements (Master Mode, Cke = 0)
- FIGURE 26-10: Example SPI Master Mode Timing (CKE = 1)
- TABLE 26-15: Example SPI Mode Requirements (Master Mode, CKE = 1)
- FIGURE 26-11: Example SPI Slave Mode Timing (CKE = 0)
- TABLE 26-16: Example SPI Mode Requirements (Slave Mode Timing, CKE = 0)
- FIGURE 26-12: Example SPI Slave Mode Timing (CKE = 1)
- TABLE 26-17: Example SPI Slave Mode Requirements (CKE = 1)
- FIGURE 26-13: I2C™ Bus Start/Stop Bits Timing
- TABLE 26-18: I2C™ Bus Start/Stop Bits Requirements (Slave Mode)
- FIGURE 26-14: I2C™ Bus Data Timing
- TABLE 26-19: I2C™ Bus Data Requirements (Slave Mode)
- FIGURE 26-15: MSSP I2C™ Bus Start/Stop Bits Timing Waveforms
- TABLE 26-20: MSSP I2C™ Bus Start/Stop Bits Requirements
- FIGURE 26-16: MSSP I2C™ Bus Data Timing
- TABLE 26-21: MSSP I2C™ Bus Data Requirements
- FIGURE 26-17: EUSART/AUSART Synchronous Transmission (Master/Slave) Timing
- TABLE 26-22: EUSART/AUSART Synchronous Transmission Requirements
- FIGURE 26-18: EUSART/AUSART Synchronous Receive (Master/Slave) Timing
- TABLE 26-23: EUSART/AUSART Synchronous Receive Requirements
- TABLE 26-24: A/D Converter Characteristics: PIC18F85J90 family (Industrial)
- FIGURE 26-19: A/D Conversion Timing
- TABLE 26-25: A/D Conversion Requirements
- 27.0 Packaging Information
- Appendix A: Revision History
- Appendix B: Migration Between High-End Device Families
- Index
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Reader Response
- Product Identification System
- Worldwide Sales and Service

2010 Microchip Technology Inc. DS39770C-page 53
PIC18F85J90 FAMILY
5.2 Master Clear (MCLR)
The MCLR pin provides a method for triggering a hard
external Reset of the device. A Reset is generated by
holding the pin low. PIC18 extended microcontroller
devices have a noise filter in the MCLR
Reset path
which detects and ignores small pulses.
The MCLR
pin is not driven low by any internal Resets,
including the WDT.
5.3 Power-on Reset (POR)
A Power-on Reset condition is generated on-chip
whenever V
DD rises above a certain threshold. This
allows the device to start in the initialized state when
V
DD is adequate for operation.
To take advantage of the POR circuitry, tie the MCLR
pin through a resistor (1 k to 10 k) to VDD. This will
eliminate external RC components usually needed to
create a Power-on Reset delay. A minimum rise rate for
V
DD is specified (parameter D004). For a slow rise
time, see Figure 5-2.
When the device starts normal operation (i.e., exits the
Reset condition), device operating parameters
(voltage, frequency, temperature, etc.) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met.
Power-on Reset events are captured by the POR
bit
(RCON<1>). The state of the bit is set to ‘0’ whenever
a Power-on Reset occurs; it does not change for any
other Reset event. POR
is not reset to ‘1’ by any
hardware event. To capture multiple events, the user
manually resets the bit to ‘1’ in software following any
Power-on Reset.
5.4 Brown-out Reset (BOR)
The PIC18F85J90 family of devices incorporates a
simple BOR function when the internal regulator is
enabled (ENVREG pin is tied to V
DD). The voltage reg-
ulator will trigger a Brown-out Reset when output of the
regulator to the device core approaches the voltage at
which the device is unable to run at full speed. The
BOR circuit also keeps the device in Reset as V
DD
rises, until the regulator’s output level is sufficient for
full-speed operation.
Once a BOR has occurred, the Power-up Timer will
keep the chip in Reset for T
PWRT (parameter 33). If
V
DD drops below the threshold for full-speed operation
while the Power-up Timer is running, the chip will go
back into a Brown-out Reset and the Power-up Timer
will be initialized. Once V
DD rises to the point where
regulator output is sufficient, the Power-up Timer will
execute the additional time delay.
FIGURE 5-2: EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW V
DD POWER-UP)
5.4.1 DETECTING BOR
The BOR bit always resets to ‘0’ on any Brown-out
Reset or Power-on Reset event. This makes it difficult
to determine if a Brown-out Reset event has occurred
just by reading the state of BOR
alone. A more reliable
method is to simultaneously check the state of both
POR and BOR. This assumes that the POR bit is reset
to ‘1’ in software immediately after any Power-on Reset
event. If BOR
is ‘0’ while POR is ‘1’, it can be reliably
assumed that a Brown-out Reset event has occurred.
If the voltage regulator is disabled, Brown-out Reset
functionality is disabled. In this case, the BOR
bit
cannot be used to determine a Brown-out Reset event.
The BOR
bit is still cleared by a Power-on Reset event.
5.5 Configuration Mismatch (CM)
The Configuration Mismatch (CM) Reset register is
designed to detect and attempt to recover from
random, memory corrupting events. This includes
Electrostatic Discharge (ESD) events which can cause
widespread, single bit changes throughout the device
and result in catastrophic failure.
In PIC18FXXXX Flash devices, the device Configura-
tion registers (located in the configuration memory
space) are continuously monitored during operation by
comparing their values to complimentary shadow reg-
isters. If a mismatch is detected between the two sets
of registers, a CM Reset automatically occurs.
These events are captured by the CM
bit (RCON<5>).
Whenever a CM event occurs, this bit is set to ‘0’. For
any other Reset event, this bit does not change.
Note 1: External Power-on Reset circuit is required
only if the V
DD power-up slope is too slow.
The diode D helps discharge the capacitor
quickly when V
DD powers down.
2: R < 40 k is recommended to make sure that
the voltage drop across R does not violate
the device’s electrical specification.
3: R1 1 k will limit any current flowing into
MCLR
from external capacitor C, in the event
of MCLR
/VPP pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS).
C
R1
R
D
V
DD
MCLR
PIC18F85J90
VDD