Datasheet
Table Of Contents
- Low-Power Features:
- LCD Driver Module Features:
- Special Microcontroller Features:
- Flexible Oscillator Structure:
- Peripheral Highlights:
- Pin Diagrams
- Pin Diagrams (Continued)
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 1.1 Core Features
- 1.2 LCD Driver
- 1.3 Other Special Features
- 1.4 Details on Individual Family Members
- TABLE 1-1: Device Features for the PIC18F85J90 family (64-pin Devices)
- TABLE 1-2: Device Features for the PIC18F85J90 family (80-pin Devices)
- FIGURE 1-1: PIC18F6XJ90 (64-pin) Block Diagram
- FIGURE 1-2: PIC18F8XJ90 (80-pin) Block Diagram
- TABLE 1-3: PIC18F6XJ90 Pinout I/O Descriptions
- TABLE 1-4: PIC18F8XJ90 Pinout I/O Descriptions
- 2.0 Guidelines for Getting Started with PIC18FJ Microcontrollers
- 3.0 Oscillator Configurations
- 3.1 Oscillator Types
- 3.2 Control Registers
- 3.3 Clock Sources and Oscillator Switching
- 3.4 External Oscillator Modes
- 3.5 Internal Oscillator Block
- 3.6 Effects of Power-Managed Modes on the Various Clock Sources
- 3.7 Power-up Delays
- 4.0 Power-Managed Modes
- 5.0 Reset
- 6.0 Memory Organization
- 6.1 Program Memory Organization
- 6.2 PIC18 Instruction Cycle
- 6.3 Data Memory Organization
- 6.4 Data Addressing Modes
- 6.5 Program Memory and the Extended Instruction Set
- 6.6 Data Memory and the Extended Instruction Set
- 7.0 Flash Program Memory
- 7.1 Table Reads and Table Writes
- 7.2 Control Registers
- 7.3 Reading the Flash Program Memory
- 7.4 Erasing Flash Program Memory
- 7.5 Writing to Flash Program Memory
- 7.6 Flash Program Operation During Code Protection
- 8.0 8 X 8 Hardware Multiplier
- 8.1 Introduction
- 8.2 Operation
- EXAMPLE 8-1: 8 x 8 Unsigned Multiply Routine
- EXAMPLE 8-2: 8 x 8 Signed Multiply Routine
- TABLE 8-1: Performance Comparison for Various Multiply Operations
- EQUATION 8-1: 16 x 16 Unsigned Multiplication Algorithm
- EXAMPLE 8-3: 16 x 16 Unsigned Multiply Routine
- EQUATION 8-2: 16 x 16 Signed Multiplication Algorithm
- EXAMPLE 8-4: 16 x 16 Signed Multiply Routine
- 9.0 Interrupts
- 10.0 I/O Ports
- FIGURE 10-1: Generic I/O Port Operation
- 10.1 I/O Port Pin Capabilities
- 10.2 PORTA, TRISA and LATA Registers
- 10.3 PORTB, TRISB and LATB Registers
- 10.4 PORTC, TRISC and LATC Registers
- 10.5 PORTD, TRISD and LATD Registers
- 10.6 PORTE, TRISE and LATE Registers
- 10.7 PORTF, LATF and TRISF Registers
- 10.8 PORTG, TRISG and LATG Registers
- 10.9 PORTH, LATH and TRISH Registers
- 10.10 PORTJ, TRISJ and LATJ Registers
- 11.0 Timer0 Module
- 12.0 Timer1 Module
- 13.0 Timer2 Module
- 14.0 Timer3 Module
- 15.0 Capture/Compare/PWM (CCP) Modules
- 16.0 Liquid Crystal Display (LCD) Driver Module
- FIGURE 16-1: LCD Driver Module Block Diagram
- 16.1 LCD Registers
- 16.2 LCD Clock Source
- 16.3 LCD Bias Generation
- 16.4 LCD Multiplex Types
- 16.5 Segment Enables
- 16.6 Pixel Control
- 16.7 LCD Frame Frequency
- 16.8 LCD Waveform Generation
- FIGURE 16-6: Type-A/Type-B Waveforms in Static Drive
- FIGURE 16-7: Type-A Waveforms in 1/2 MUX, 1/2 Bias Drive
- FIGURE 16-8: Type-B Waveforms in 1/2 MUX, 1/2 Bias Drive
- FIGURE 16-9: Type-A Waveforms in 1/2 MUX, 1/3 Bias Drive
- FIGURE 16-10: Type-B Waveforms in 1/2 MUX, 1/3 Bias Drive
- FIGURE 16-11: Type-A Waveforms in 1/3 MUX, 1/2 Bias Drive
- FIGURE 16-12: Type-B Waveforms in 1/3 MUX, 1/2 Bias Drive
- FIGURE 16-13: Type-A Waveforms in 1/3 MUX, 1/3 Bias Drive
- FIGURE 16-14: Type-B Waveforms in 1/3 MUX, 1/3 Bias Drive
- FIGURE 16-15: Type-A Waveforms in 1/4 MUX, 1/3 Bias Drive
- FIGURE 16-16: Type-B Waveforms in 1/4 MUX, 1/3 Bias Drive
- 16.9 LCD Interrupts
- 16.10 Operation During Sleep
- 16.11 Configuring the LCD Module
- 17.0 Master Synchronous Serial Port (MSSP) Module
- 17.1 Master SSP (MSSP) Module Overview
- 17.2 Control Registers
- 17.3 SPI Mode
- FIGURE 17-1: MSSP Block Diagram (SPI Mode)
- 17.3.1 Registers
- 17.3.2 Operation
- 17.3.3 Enabling SPI I/O
- 17.3.4 Open-Drain Output Option
- 17.3.5 Typical Connection
- 17.3.6 Master Mode
- 17.3.7 Slave Mode
- 17.3.8 Slave Select Synchronization
- 17.3.9 Operation in Power-Managed Modes
- 17.3.10 Effects of a Reset
- 17.3.11 Bus Mode Compatibility
- 17.4 I2C Mode
- FIGURE 17-7: MSSP Block Diagram (I2C™ Mode)
- 17.4.1 Registers
- 17.4.2 Operation
- 17.4.3 Slave Mode
- EXAMPLE 17-2: Address Masking Examples
- FIGURE 17-8: I2C™ Slave Mode Timing with SEN = 0 (Reception, 7-bit Address)
- FIGURE 17-9: I2C™ Slave Mode Timing with SEN = 0 and ADMSK<5:1> = 01011 (Reception, 7-bit Address)
- FIGURE 17-10: I2C™ Slave Mode Timing (Transmission, 7-bit Address)
- FIGURE 17-11: I2C™ Slave Mode Timing with SEN = 0 (Reception, 10-bit Address)
- FIGURE 17-12: I2C™ Slave Mode Timing with SEN = 0 and ADMSK<5:1> = 01001 (Reception, 10-bit Address)
- FIGURE 17-13: I2C™ Slave Mode Timing (Transmission, 10-bit Address)
- 17.4.4 Clock Stretching
- 17.4.5 General Call Address Support
- 17.4.6 Master Mode
- 17.4.7 Baud Rate
- 17.4.8 I2C Master Mode Start Condition Timing
- 17.4.9 I2C Master Mode Repeated Start Condition Timing
- 17.4.10 I2C Master Mode Transmission
- 17.4.11 I2C Master Mode Reception
- 17.4.12 Acknowledge Sequence Timing
- 17.4.13 Stop Condition Timing
- 17.4.14 Sleep Operation
- 17.4.15 Effects of a Reset
- 17.4.16 Multi-Master Mode
- 17.4.17 Multi -Master Communication, Bus Collision and Bus Arbitration
- FIGURE 17-27: Bus Collision Timing for Transmit and Acknowledge
- FIGURE 17-28: Bus Collision During Start Condition (SDA Only)
- FIGURE 17-29: Bus Collision During Start Condition (SCL = 0)
- FIGURE 17-30: BRG Reset Due to SDA Arbitration During Start Condition
- FIGURE 17-31: Bus Collision During a Repeated Start Condition (Case 1)
- FIGURE 17-32: Bus Collision During Repeated Start Condition (Case 2)
- FIGURE 17-33: Bus Collision During a Stop Condition (Case 1)
- FIGURE 17-34: Bus Collision During a Stop Condition (Case 2)
- TABLE 17-4: Registers Associated with I2C™ Operation
- 18.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART)
- 18.1 Control Registers
- 18.2 EUSART Baud Rate Generator (BRG)
- 18.3 EUSART Asynchronous Mode
- 18.4 EUSART Synchronous Master Mode
- 18.5 EUSART Synchronous Slave Mode
- 19.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART)
- 19.1 Control Registers
- 19.2 AUSART Baud Rate Generator (BRG)
- 19.3 AUSART Asynchronous Mode
- 19.4 AUSART Synchronous Master Mode
- 19.5 AUSART Synchronous Slave Mode
- 20.0 10-bit Analog-to-Digital Converter (A/D) Module
- Register 20-1: ADCON0: A/D Control Register 0
- Register 20-2: ADCON1: A/D Control Register 1
- Register 20-3: ADCON2: A/D Control Register 2
- FIGURE 20-1: A/D Block Diagram(1,2)
- FIGURE 20-2: Analog Input Model
- 20.1 A/D Acquisition Requirements
- 20.2 Selecting and Configuring Automatic Acquisition Time
- 20.3 Selecting the A/D Conversion Clock
- 20.4 Configuring Analog Port Pins
- 20.5 A/D Conversions
- 20.6 Use of the CCP2 Trigger
- 20.7 A/D Converter Calibration
- 20.8 Operation in Power-Managed Modes
- 21.0 Comparator Module
- Register 21-1: CMCON: Comparator Module Control Register
- 21.1 Comparator Configuration
- 21.2 Comparator Operation
- 21.3 Comparator Reference
- 21.4 Comparator Response Time
- 21.5 Comparator Outputs
- 21.6 Comparator Interrupts
- 21.7 Comparator Operation During Sleep
- 21.8 Effects of a Reset
- 21.9 Analog Input Connection Considerations
- 22.0 Comparator Voltage Reference Module
- 23.0 Special Features of the CPU
- 23.1 Configuration Bits
- 23.1.1 Considerations for Configuring the PIC18F85J90 family Devices
- TABLE 23-1: Mapping of the Flash Configuration Words to the Configuration Registers
- TABLE 23-2: Configuration Bits and Device IDs
- Register 23-1: CONFIG1L: Configuration Register 1 Low (Byte Address 300000h)
- Register 23-2: CONFIG1H: Configuration Register 1 High (Byte Address 300001h)
- Register 23-3: CONFIG2L: Configuration Register 2 Low (Byte Address 300002h)
- Register 23-4: CONFIG2H: Configuration Register 2 High (Byte Address 300003h)
- Register 23-5: CONFIG3H: Configuration Register 3 High (Byte Address 300005h)
- Register 23-6: DEVID1: Device ID Register 1 for PIC18F85J90 family Devices
- Register 23-7: DEVID2: Device ID Register 2 for PIC18F85J90 family Devices
- 23.1.1 Considerations for Configuring the PIC18F85J90 family Devices
- 23.2 Watchdog Timer (WDT)
- 23.3 On-Chip Voltage Regulator
- 23.4 Two-Speed Start-up
- 23.5 Fail-Safe Clock Monitor
- 23.6 Program Verification and Code Protection
- 23.7 In-Circuit Serial Programming
- 23.8 In-Circuit Debugger
- 23.1 Configuration Bits
- 24.0 Instruction Set Summary
- 24.1 Standard Instruction Set
- 24.2 Extended Instruction Set
- 25.0 Development Support
- 25.1 MPLAB Integrated Development Environment Software
- 25.2 MPLAB C Compilers for Various Device Families
- 25.3 HI-TECH C for Various Device Families
- 25.4 MPASM Assembler
- 25.5 MPLINK Object Linker/ MPLIB Object Librarian
- 25.6 MPLAB Assembler, Linker and Librarian for Various Device Families
- 25.7 MPLAB SIM Software Simulator
- 25.8 MPLAB REAL ICE In-Circuit Emulator System
- 25.9 MPLAB ICD 3 In-Circuit Debugger System
- 25.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express
- 25.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express
- 25.12 MPLAB PM3 Device Programmer
- 25.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits
- 26.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 26.1 DC Characteristics: Supply Voltage PIC18F85J90 Family (Industrial)
- 26.2 DC Characteristics: Power-Down and Supply Current PIC18F85J90 Family (Industrial)
- 26.3 DC Characteristics: PIC18F84J90 Family (Industrial)
- 26.4 AC (Timing) Characteristics
- 26.4.1 Timing Parameter Symbology
- 26.4.2 Timing Conditions
- 26.4.3 Timing Diagrams and Specifications
- FIGURE 26-4: External Clock Timing
- TABLE 26-7: External Clock Timing Requirements
- TABLE 26-8: PLL Clock Timing Specifications (Vdd = 2.15V to 3.6V)
- TABLE 26-9: Internal RC Accuracy (INTOSC and INTRC Sources)
- FIGURE 26-5: CLKO and I/O Timing
- TABLE 26-10: CLKO and I/O Timing Requirements
- FIGURE 26-6: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing
- TABLE 26-11: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements
- FIGURE 26-7: Timer0 and Timer1 External Clock Timings
- TABLE 26-12: Timer0 and Timer1 External Clock Requirements
- FIGURE 26-8: Capture/Compare/PWM Timings (CCP1, CCP2 Modules)
- TABLE 26-13: Capture/Compare/PWM Requirements (CCP1, CCP2 Modules)
- FIGURE 26-9: Example SPI Master Mode Timing (CKE = 0)
- TABLE 26-14: Example SPI Mode Requirements (Master Mode, Cke = 0)
- FIGURE 26-10: Example SPI Master Mode Timing (CKE = 1)
- TABLE 26-15: Example SPI Mode Requirements (Master Mode, CKE = 1)
- FIGURE 26-11: Example SPI Slave Mode Timing (CKE = 0)
- TABLE 26-16: Example SPI Mode Requirements (Slave Mode Timing, CKE = 0)
- FIGURE 26-12: Example SPI Slave Mode Timing (CKE = 1)
- TABLE 26-17: Example SPI Slave Mode Requirements (CKE = 1)
- FIGURE 26-13: I2C™ Bus Start/Stop Bits Timing
- TABLE 26-18: I2C™ Bus Start/Stop Bits Requirements (Slave Mode)
- FIGURE 26-14: I2C™ Bus Data Timing
- TABLE 26-19: I2C™ Bus Data Requirements (Slave Mode)
- FIGURE 26-15: MSSP I2C™ Bus Start/Stop Bits Timing Waveforms
- TABLE 26-20: MSSP I2C™ Bus Start/Stop Bits Requirements
- FIGURE 26-16: MSSP I2C™ Bus Data Timing
- TABLE 26-21: MSSP I2C™ Bus Data Requirements
- FIGURE 26-17: EUSART/AUSART Synchronous Transmission (Master/Slave) Timing
- TABLE 26-22: EUSART/AUSART Synchronous Transmission Requirements
- FIGURE 26-18: EUSART/AUSART Synchronous Receive (Master/Slave) Timing
- TABLE 26-23: EUSART/AUSART Synchronous Receive Requirements
- TABLE 26-24: A/D Converter Characteristics: PIC18F85J90 family (Industrial)
- FIGURE 26-19: A/D Conversion Timing
- TABLE 26-25: A/D Conversion Requirements
- 27.0 Packaging Information
- Appendix A: Revision History
- Appendix B: Migration Between High-End Device Families
- Index
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Reader Response
- Product Identification System
- Worldwide Sales and Service
2010 Microchip Technology Inc. DS39770C-page 365
PIC18F85J90 FAMILY
Supply Current (IDD)
(2)
All devices 165 490 µA -40°C
V
DD = 2.0V,
V
DDCORE = 2.0V
(4)
FOSC = 1 MHZ
(PRI_RUN mode,
EC oscillator)
180 490 µA +25°C
200 490 µA +85°C
All devices 256 670 µA -40°C
V
DD = 2.5V,
V
DDCORE = 2.5V
(4)
260 670 µA +25°C
280 670 µA +85°C
All devices 460 850 µA -40°C
V
DD = 3.3V
(5)
456 850 µA +25°C
482 850 µA +85°C
All devices 0.632 2.2 mA -40°C
V
DD = 2.0V,
V
DDCORE = 2.0V
(4)
FOSC = 4 MHz
(PRI_RUN mode,
EC oscillator)
0.681 2.2 mA +25°C
0.738 2.2 mA +85°C
All devices 0.912 2.5 mA -40°C
V
DD = 2.5V,
V
DDCORE = 2.5V
(4)
1.04 2.5 mA +25°C
1.04 2.5 mA +85°C
All devices 1.32 3.0 mA -40°C
V
DD = 3.3V
(5)
1.32 3.0 mA +25°C
1.41 3.0 mA +85°C
All devices 7.47 14 mA -40°C
V
DD = 2.5V,
V
DDCORE = 2.5V
(4)
FOSC = 40 MHZ
(PRI_RUN mode,
EC oscillator)
5.81 14 mA +25°C
6.32 13 mA +85°C
All devices 8.84 18 mA -40°C
V
DD = 3.3V
(5)
8.66 18 mA +25°C
7.97 16 mA +85°C
26.2 DC Characteristics: Power-Down and Supply Current
PIC18F85J90 Family (Industrial) (Continued)
PIC18F85J90 Family
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No.
Device Typ Max Units Conditions
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in a high-impedance state and tied to V
DD or VSS, and all features that add delta
current disabled (such as WDT, Timer1 oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD;
MCLR
= VDD; WDT enabled/disabled as specified.
3: Standard, low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.
4: Voltage regulator is disabled (ENVREG tied to V
SS).
5: Voltage regulator is enabled (ENVREG tied to V
DD).
6: Resistor ladder current is not included.
7: Connecting an actual display will increase the current consumption depending on the size of the LCD.