Datasheet

PIC18F6390/6490/8390/8490
DS39629C-page 356 © 2007 Microchip Technology Inc.
Supply Current (IDD)
(2)
PIC18LF6390/6490/8390/8490 250 500 μA -40°C
VDD = 2.0V
F
OSC = 1 MHZ
(PRI_RUN,
EC oscillator)
260 500 μA +25°C
250 500 μA +85°C
PIC18LF6390/6490/8390/8490 550 650 μA -40°C
V
DD = 3.0V480 650 μA +25°C
460 650 μA +85°C
All devices 1.2 1.6 mA -40°C
V
DD = 5.0V1.1 1.5 mA +25°C
1.0 1.4 mA +85°C
PIC18LF6390/6490/8390/8490 0.72 2.0 mA -40°C
V
DD = 2.0V
F
OSC = 4 MHz
(PRI_RUN,
EC oscillator)
0.74 2.0 mA +25°C
0.74 2.0 mA +85°C
PIC18LF6390/6490/8390/8490 1.3 3.0 mA -40°C
V
DD = 3.0V1.3 3.0 mA +25°C
1.3 3.0 mA +85°C
All devices 2.7 6.0 mA -40°C
V
DD = 5.0V2.6 6.0 mA +25°C
2.5 6.0 mA +85°C
All devices 15 35 mA -40°C
V
DD = 4.2V
F
OSC = 40 MHZ
(PRI_RUN,
EC oscillator)
16 35 mA +25°C
16 35 mA +85°C
All devices 21 40 mA -40°C
V
DD = 5.0V21 40 mA +25°C
21 40 mA +85°C
26.2 DC Characteristics: Power-Down and Supply Current
PIC18F6390/6490/8390/8490 (Industrial)
PIC18LF6390/6490/8390/8490 (Industrial) (Continued)
PIC18LF6390/6490/8390/8490
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18F6390/6490/8390/8490
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD or VSS;
MCLR
= VDD; WDT enabled/disabled as specified.
3: Low-power Timer1 oscillator selected.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be
less than the sum of both specifications.