Datasheet

 2003-2013 Microchip Technology Inc. DS30491D-page 467
PIC18F6585/8585/6680/8680
68-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
10501050

Mold Draft Angle Bottom
10501050

Mold Draft Angle Top
0.530.510.33.021.020.013BLower Lead Width
0.810.740.66.032.029.026B1Upper Lead Width
0.330.270.20.013.011.008
c
Lead Thickness
1717n1Pins per Side
23.6223.3722.61.930.920.890
D2
Footprint Length
23.6223.3722.61.930.920.890E2Footprint Width
24.3324.2324.13.958.954.950D1Molded Package Length
24.3324.2324.13.958.954.950E1Molded Package Width
25.2725.1525.02.995.990.985DOverall Length
25.2725.1525.02.995.990.985EOverall Width
0.250.130.00.010.005.000CH2Corner Chamfer (others)
1.27
1.141.02.050.045.040CH1Corner Chamfer 1
0.860.740.61.034.029.024A3Side 1 Chamfer Height
0.51.020A1Standoff §
A2Molded Package Thickness
4.574.394.19.180.173.165AOverall Height
1.27.050
p
Pitch
68
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units

A2
c
E2
2
DD1
n
#leads=n1
E
E1
1

p
B
A3
A
B1
32
D2
68
A1
.145 .153 .160 3.68 3.87 4.06
.028 .035 0.71 0.89
CH1 x 45

CH2 x 45

* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-049
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
18F8680.book Page 467 Tuesday, January 29, 2013 1:32 PM