Datasheet

PIC18F6525/6621/8525/8621
DS39612C-page 378  2003-2013 Microchip Technology Inc.
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
1.101.00.043.039
1.140.890.64.045.035.025CHPin 1 Corner Chamfer
1.00.039
(F)
Footprint (Reference)
(F)
E
E1
#leads=n1
p
B
D1
D
n
1
2
φ
c
β
L
A
A1
A2
α
Units INCHES MILLIMETERS*
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins
n
80 80
Pitch
p
.020 0.50
Overall Height A .047 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff A1 .002 .004 .006 0.05 0.10 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Foot Angle
φ
0 3.5 7 0 3.5 7
Overall Width E .541 .551 .561 13.75 14.00 14.25
Overall Length D .541 .551 .561 13.75 14.00 14.25
Molded Package Width E1 .463 .472 .482 11.75 12.00 12.25
Molded Package Length D1 .463 .472 .482 11.75 12.00 12.25
Pins per Side n1 20 20
Lead Thickness
c
.004 .006 .008 0.09 0.15 0.20
Lead Width B .007 .009 .011 0.17 0.22 0.27
Mold Draft Angle Top
α
51015 51015
Mold Draft Angle Bottom
β
51015 51015
CH x 45°
shall not exceed .010" (0.254mm) per side.
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
Notes:
JEDEC Equivalent: MS-026
Drawing No. C04-092
*Controlling Parameter
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging